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A technology of wood adhesives and soybean flour, which is applied in the preparation of adhesives, animal glue or gelatin, and the type of adhesives. It can solve the problems of hazards, non-renewability of petroleum-based adhesives, and high formaldehyde release, and meet the requirements of use. Effect
Active Publication Date: 2009-08-05
山东万得福生物科技有限公司
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Problems solved by technology
At the beginning of the last century, soybean adhesives were widely used in the production of wood-based panels, but were later replaced by urea-formaldehyde resins with good water resistance and low price. very harmful
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preparation example Construction
[0012] The preparation method of wood adhesive comprises soybean flour aqueous solution: 1-7 parts, phenolic formaldehyde (commercially available E1 grade): 9-3 parts, cellulase: 0.1-0.5%, pectinase: 0.1-0.5%, neutral Or alkaline protease: 0.01-0.5% etc. are produced as raw materials, and it is characterized in that:
[0013] Step 1: Prepare an aqueous solution of defatted soybean flour with a concentration of 20-30%, heat it to 50±2°C, and then adjust the pH value to 4.5 with a concentration of 5-30% inorganic acid or organic acid (such as hydrochloric acid, phosphoric acid, lactic acid, etc.) -5.5, then add 0-0.5% cellulase and pectinase respectively, hydrolyze for 30-120 minutes;
[0014] Step 2: the alkali concentration is 0-30% (such as sodium hydroxide, potassium hydroxide, ammonia water, etc.) to adjust the pH value to be above neutral, and hydrolyze with 0.01-0.5% neutral or alkaline protease, and the hydrolysis time is 30 -120 minutes;
[0015] Step 3: adjust the pH...
Embodiment 1
[0019] Prepare a 30% aqueous solution of soybean flour, add hydrochloric acid while stirring, adjust the pH to 5.0, then raise the temperature to 50°C, add 0.2% pectinase and 0.1% cellulase, hydrolyze for 120 minutes, and then adjust the pH to 8.0 , add 0.2% alkaline protease, hydrolyze for 120 minutes, adjust pH 10.0 with sodium hydroxide, then weigh 20 parts and mix with 80 parts of phenolic resin.
Embodiment 2
[0021] Prepare a 30% aqueous solution of soybean flour, add hydrochloric acid while stirring, adjust the pH to 8.0 with sodium hydroxide, add 0.2% alkaline protease, hydrolyze for 120 minutes, adjust the pH to 10.0 with sodium hydroxide, and then weigh 20 parts Mixed with 80 parts of phenolic resin.
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Abstract
The invention discloses a preparation method of wood adhesive which is prepared by 10-70 portions of modified soybean flour solution and 90-130 portions of phenol formaldehyde adhesive (E1 level in market). The preparation method comprises the following steps: preparing 20-30 percent of solution by more than 100 mu of defatted soybean flour condensate, adjusting the pH value to be 4.5-5.5; respectively adding 0.1-0.5 percent of cellulose and 0.01-0.5 percent of pectase; hydrolyzing the solution added with the cellulose and the pectase for 30-120 minutes at the temperature of 48-52 DEG C; adjusting the pH value to be 7.0-10; hydrolyzing the solution added with the cellulose and the pectase for 30-120 minutes by 0.01-0.5 percent of neutral or alkali protease; adjusting the pH value to be 7.5-10.5, and mixing the solution added with the cellulose and the pectase with metlbond according to the proportion of 10-70 portions so as to obtain the wood adhesive. The release amount of formaldehyde achieves the E0 level of European standard. The wood adhesive has lower viscocity which can achieve less than 30s by mixing with the low-viscocity phenolic resin, thereby meeting the use requirements of spraying and coating.
Description
technical field [0001] The invention relates to an adhesive, in particular to a wood adhesive and a preparation method thereof. Background technique [0002] There are many types of wood adhesives. Wood-based panel factories mainly use adhesives such as urea-formaldehyde resin and phenolic resin to produce boards such as fiberboard, plywood, and particle board. The board produced by phenolic resin has good bonding strength and water resistance, and can be used to build houses, car boards and other products that require high bonding performance. The formaldehyde emission of the board made of ordinary phenolic resin can reach the E1 level, and the formaldehyde emission of the modified phenolic adhesive can reach the European standard E0 level, and the price is also higher. At the beginning of the last century, soybean adhesives were widely used in the production of wood-based panels, but they were later replaced by urea-formaldehyde resins with good water resistance and low p...
Claims
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Application Information
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