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Laminate, method of forming conductive pattern, conductive pattern obtained thereby, printed wiring board, thin-layer transistor and apparatus utilizing these

A laminate, conductive technology, applied in printed circuits, printed circuit manufacturing, chemical instruments and methods, etc., can solve the problems of substrate surface erosion, the inability of substrates to adhere to metal circuits, circuit difficulties, etc., to achieve adhesion excellent effect

Inactive Publication Date: 2009-09-02
FUJIFILM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, regarding the plating film produced by this method, when forming a metal circuit by the full additive method (which only utilizes the electroless plating method), a plating thickness of several micrometers is required from the viewpoint of conductivity, durability, etc. In this regard, when the base material is a variety of glass substrates containing quartz glass, the plating solution is mostly strongly alkaline during electroless plating. attached question
This problem can be solved by shortening the processing time, but when the circuit is formed by electroplating, the film thickness of the circuit is proportional to the processing time, so it is very difficult to form a circuit that satisfies the electrical characteristics such as impedance value

Method used

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  • Laminate, method of forming conductive pattern, conductive pattern obtained thereby, printed wiring board, thin-layer transistor and apparatus utilizing these
  • Laminate, method of forming conductive pattern, conductive pattern obtained thereby, printed wiring board, thin-layer transistor and apparatus utilizing these
  • Laminate, method of forming conductive pattern, conductive pattern obtained thereby, printed wiring board, thin-layer transistor and apparatus utilizing these

Examples

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Embodiment

[0180] Hereinafter, although an Example demonstrates this invention, this invention is not limited to these Examples.

Synthetic example 1

[0181] Synthesis Example 1: Polymer T1 forming a polymerization initiation layer

[0182] 9.00 g of IRGACURE 2959 (manufactured by Ciba Specialty Chemicals) was dissolved in 30 mL of THF, and 20 mg of p-methoxyphenol, 6.28 g of 2-methacryloyloxyethyl isocyanate, 81 mg of dibutyltin dilaurate were added thereto . The reaction was carried out at 50° C. for 4 hours. The solvent was removed under reduced pressure and recrystallized from ethyl acetate-hexane to give a white solid.

[0183] Then, 10 g of this white solid was dissolved in 50 mL of methyl ethyl ketone, 15.7 g of glycidyl methacrylate and 140 mg of AIBN were added, the temperature was raised to 70° C., and the mixture was reacted for 6 hours. Then, this solution was reprecipitated with hexane, whereby polymer T1 forming a polymerization initiation layer was obtained.

[0184] In addition, the polymer T1 forming the polymerization initiation layer is the exemplary compound T1 cited as a specific example of the compou...

Synthetic example 2

[0185] Synthesis Example 2: Polymer T2 forming a polymerization initiation layer

[0186] 16.4 g of 2,4-bistrichloromethyl-6-(4-hydroxyphenyl) triazine was dissolved in 50 mL of THF, and 20 mg of p-methoxyphenol and 6.28 g of isocyanic acid 2 were added thereto. - Methacryloyloxyethyl ester, 81 mg dibutyltin dilaurate. The reaction was carried out at 50° C. for 4 hours. The solvent was removed under reduced pressure, and recrystallized from ethyl acetate-hexane to obtain a yellow solid.

[0187] Then, 10 g of the yellow solid was dissolved in 168 mL of dimethylacetamide, 8.85 g of glycidyl methacrylate and 140 mg of AIBN were added, the temperature was raised to 70° C., and the mixture was reacted for 6 hours. Then, this solution was reprecipitated with hexane to obtain a polymer T2 forming a polymerization initiation layer. In addition, the polymer T2 forming the polymerization initiation layer is the exemplary compound T2 cited as a specific example of the compound (Q-Y)....

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Abstract

A laminate comprising a glass substratum; a polymerization initiation layer of 0.1 to 100 [mu]m thickness formed by chemical bonding, to the glass substratum, of a polymer having a radical polymerization initiation moiety and a moiety capable of direct chemical bonding to the glass substratum; and a graft polymer precursor layer containing a polymer having in its molecule a skeleton derived from a structure selected from among (meth)acrylic ester and (meth)acrylamide and having an unsaturated moiety capable of radical polymerization and a moiety capable of adsorbing an electroless plating catalyst. Further, there is provided a method of forming a conductive pattern with the use of the laminate.

Description

technical field [0001] The present invention relates to a laminate, a method for forming a conductive pattern using the laminate, a conductive pattern, a printed circuit board and a thin-layer transistor provided with the conductive pattern, and a device using them. Background technique [0002] When forming electronic circuits such as printed circuit boards, it is increasingly required to form circuits on large-area substrates. Microcircuits with high fineness and excellent conductivity are generally formed by vapor phase methods such as vacuum film formation. However, with this method, it is difficult to form a metal film with uniform film thickness and film quality over a large area, so it is urgently desired to form highly reliable lines, electrodes, and the like. [0003] In addition, if a metal film is formed on a large-area panel by the vapor phase method, a huge vacuum film forming device and auxiliary equipment such as gas supply equipment are required, which cause...

Claims

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Application Information

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IPC IPC(8): B32B17/10C03C17/34H05K3/18
Inventor 松下泰明佐藤弘司
Owner FUJIFILM CORP
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