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Boracic Cu-P-based amorphous brazing filler metal and method for preparing same

A brazing filler metal and amorphous technology is applied in the field of boron-containing Cu-P-based amorphous brazing filler metal and its preparation, which can solve the problems of reduced joint strength and the like

Inactive Publication Date: 2009-09-16
JIANGSU UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the strength of the joint is reduced

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] Component formula: The components and content of the brazing filler metal are as follows: P: 7.2%; Ni: 14.0%;

[0032] Sn: 5.4%; B: 0.03%; Si: 0.2%; the rest is Cu.

[0033] Preparation:

[0034] (1) with P; Ni; Sn; B; Si; After Cu raw material is pulverized respectively, formula is weighed on the electronic balance, wherein the mass fraction of boron in the copper-boron alloy is 13.5%, and the mass fraction of silicon in the copper-silicon alloy is 15%, the mass fraction of phosphorus in the copper-phosphorus alloy is 14.56%;

[0035] (2) Place the ingredients according to the above formula in the WS-2 type high vacuum Ar atmosphere protection non-consumable electric arc furnace manufactured by the Beijing Institute of Physics, Chinese Academy of Sciences. There are 5 copper crucibles in the electric arc furnace, and a piece of pure copper is placed in one of the crucibles. Ti sample, the remaining four crucibles can hold four ingredients of the same formula or diffe...

Embodiment 2

[0048] Component formulation: The components and contents of the brazing filler metal are as follows: P: 7.2%; Ni: 14%; Sn: 5.4%; B: 0.02%; Si: 0.2%; the rest is Cu.

[0049] Preparation method: same as the preparation method of Example 1.

[0050] The melting temperature range of the solder is 602-646°C, and the joint shear strength of the flame brazing red copper is 112MPa.

Embodiment 3

[0052] Component formulation: The components and contents of the brazing filler metal are as follows: P: 7.2%; Ni: 14%; Sn: 5.4%; B: 0.04%; Si: 0.2%; the rest is Cu.

[0053] Prepare each method: same as embodiment 1 preparation method.

[0054] The melting temperature range of the solder is 637-663°C, and the joint shear strength of the flame brazing red copper is 121MPa.

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Abstract

The invention discloses a boracic Cu-P-based amorphous brazing filler metal and a method for preparing the same, which belong to the technical field of the brazing of amorphous brazing filler metal and copper as well as copper alloy. The amorphous brazing filler metal comprises the following components in percentage by weight: 7.2 percent of P, 14.0 percent of Ni, 5.4 percent of Sn, 0.02 to 0.04 percent of B, 0.2 percent of Si, and the balance of Cu. The amorphous brazing filler metal is prepared by adopting a rapid solidification technique, and the prepared brazing filler metal has a bright and clean surface, two smooth sides and better toughness. The melting temperature of the amorphous brazing filler metal is between 602 and 663 DEG C and the brazing temperature is between 670 and 720 DEG C. The amorphous brazing filler metal is applicable to the brazing of the copper and the copper alloy, and applicable brazing process methods comprise flame brazing, furnace brazing, gas shield brazing, salt bath brazing, and the like. By adopting the amorphous brazing filler metal to perform flame brazing of red copper, the wetting property of the brazing filler metal is obviously better than the brazing filler metal with same components prepared by a conventional melting technique, and the shear strength of a brazed joint is more than 112 MPa.

Description

technical field [0001] The invention relates to a boron-containing Cu-P-based amorphous solder and a preparation method thereof, in particular to a boron-containing Cu-P-Sn-Ni-Si amorphous solder for brazing copper and copper alloys and a preparation method thereof, belonging to the amorphous Crystal solder and copper and copper alloy brazing technical field. Background technique [0002] Silver-based solder has a moderate melting point, good manufacturability, and good strength, toughness, electrical conductivity, thermal conductivity, and corrosion resistance. It is widely used in various fields of modern industry, such as electronics, home appliances, aerospace, energy, and automobile manufacturing. widely used. With the development of science and technology and the progress of society, the demand for silver-based solder is also increasing. In my country, the consumption of silver for making silver-based solder reaches more than 1,000 tons every year. But silver is a pr...

Claims

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Application Information

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IPC IPC(8): B23K35/30B23K35/40
Inventor 邹家生王磊汪成龙王超
Owner JIANGSU UNIV OF SCI & TECH
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