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Polyimide precursor and photosensitive resin composition containing polyimide precursor

A technology of polyimide precursor and photosensitive resin, which is applied in the field of photosensitive resin composition and photosensitive film, and can solve problems such as control and difficult structure

Inactive Publication Date: 2009-10-28
ASAHI KASEI KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The polyimide precursor described in Patent Document 3 has a random structure, so it tends to be difficult to control the structure after imidation of polyamic acid

Method used

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  • Polyimide precursor and photosensitive resin composition containing polyimide precursor
  • Polyimide precursor and photosensitive resin composition containing polyimide precursor
  • Polyimide precursor and photosensitive resin composition containing polyimide precursor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0196] Under a nitrogen atmosphere, triglyme (71.75g), toluene (20.0g), siloxane diamine (KF-8010, 18.15mmol), and TMEG (24.21mmol) were added into a detachable flask. Heat and stir at 120°C for 1 hour. Next, install a Dean-Stark apparatus and a reflux device, and heat and stir at 180° C. for 1 hour. After removing the azeotropic solvent toluene, the mixture was cooled to 25°C, then APB-N (11.55 mmol) was added, and after stirring for 10 minutes, TMEG (5.79 mmol) was added and stirred at 25°C for 8 hours. Triglyme was added after stirring so that the density|concentration of a polymer solid content might become 25 mass %, and the triglyme solution of the polyimide precursor (1) was obtained. The weight average molecular weight and z / (x+y+z) are listed in Table 1.

[0197] The thermal stability of the polyimide precursor (1) was evaluated by the thermal stability evaluation method mentioned above. The results of this evaluation are listed in Table 1. Moreover, NMR measureme...

Embodiment 2

[0203] Triglyme (36.8 g), toluene (20.0 g), siloxanediamine (X-22-161A, 5.73 mmol), TMEG (7.29 mmol) were added to a separable flask under nitrogen atmosphere , heated and stirred at 120° C. for 1 hour. Next, install a Dean-Stark apparatus and a reflux device, and heat and stir at 180° C. for 1 hour. After removing the azeotropic solvent toluene, the mixture was cooled to 25°C, then APB-N (9.58mmol) was added, and after stirring for 10 minutes, TMEG (8.02mmol) was added and stirred at 25°C for 8 hours. Triglyme was added after stirring so that the density|concentration of a polymer solid content might become 25 mass %, and the triglyme solution of a polyimide precursor was obtained. The weight average molecular weight, z / (x+y+z) and thermal stability evaluation results are listed in Table 1.

[0204] Compound B-1 (20 mass parts) and TBXP (10 mass parts) were mixed with 100 mass parts of polyimide precursors (2), and the photosensitive resin composition was prepared. Except ...

Embodiment 3

[0206] Under a nitrogen atmosphere, triglyme (50.0g), toluene (20.0g), siloxane diamine (KF-8010, 15.0mmol), and ODPA (20.0mmol) were added to a detachable flask, and Heat and stir at 120°C for 1 hour. Next, install a Dean-Stark apparatus and a reflux device, and heat and stir at 180° C. for 1 hour. After removing the azeotropic solvent toluene, it was cooled to 25°C, then APB-N (13.0 mmol) was added, and after stirring for 10 minutes, TMEG (10.0 mmol) was added and stirred at 25°C for 8 hours. Triglyme was added after stirring so that the density|concentration of a polymer solid content might become 25 mass %, and the triglyme solution of the polyimide precursor (3) was obtained. The weight average molecular weight, z / (x+y+z) and thermal stability evaluation results are listed in Table 1.

[0207] Compound B-1 (20 mass parts) and TBXP (10 mass parts) were mixed with 100 mass parts of polyimide precursors (3), and the photosensitive resin composition was prepared. Except ha...

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Abstract

Disclosed is a polyimide precursor characterized by having a polyimide structure represented by the general formula (1) below and a polyamide acid structure represented by the general formula (2) below. In the formula 1, formula 2, R1 and R6 each represents a tetravalent organic group having 1-50 carbon atoms; R2 represents a divalent organic group having 1-30 carbon atoms; R5 represents a divalent organic group having 1-80 carbon atoms; R3 represents a monovalent organic group having 1-30 carbon atoms; and n represents an integer not less than 1 but not more than 30.

Description

technical field [0001] The present invention relates to the photosensitivity of a polyimide precursor having a polyamic acid structure and a polyimide structure as repeating structural units, and a coating suitable for a printed circuit board containing the polyimide precursor and a photosensitizer A resin composition and a photosensitive film using the photosensitive resin composition. Background technique [0002] High heat-resistant resins such as polyimides are attracting attention as insulating materials excellent in heat resistance, especially as insulating layers and protective layers of solid elements in the semiconductor industry. In general, polyimide has heat resistance above 300°C and excellent mechanical properties, and also has excellent electrical properties such as low dielectric constant and high insulation. [0003] In microfabrication of general polyimide material, many steps are required for etching treatment using a photoresist. Therefore, the photosen...

Claims

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Application Information

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IPC IPC(8): C08G73/10G03F7/004G03F7/023G03F7/075H01L21/027
CPCC08G73/106G03F7/0233H05K3/287C08L79/08C08G73/1042C08G73/1046C08G73/1082H05K2201/0154C08G73/1075G03F7/0757
Inventor 早川隆志清水建树小笠原华菜子高桥秀明
Owner ASAHI KASEI KK
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