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Double light path green light micropore processing device

A technology of microhole processing and green light, which is applied in metal processing equipment, manufacturing tools, laser welding equipment, etc., can solve the problems of expensive equipment, less industrial application of picosecond lasers, and high processing costs, so as to reduce thermal effects and improve processing precision degree, cost reduction effect

Inactive Publication Date: 2009-11-04
SUZHOU DELPHI LASER
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Problems solved by technology

However, at present, there are few industrial applications of picosecond lasers, and the equipment is expensive and the processing cost is high

Method used

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  • Double light path green light micropore processing device
  • Double light path green light micropore processing device

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Embodiment Construction

[0017] A dual optical path system is designed to integrate the optical paths of nanosecond laser (wavelength 532nm) and picosecond laser (wavelength 532nm), so that two laser beams with different pulse widths emitted from nanosecond pulse laser and picosecond pulse laser pass through After calibration, it enters the optical system to focus through the same path, so as to process micro-holes.

[0018] Such as figure 1 , figure 2 As shown, the dual-path green light microhole processing device adopts dual laser light sources, including four parts: optical path selection, optical path transmission, optical path calibration and optical focusing. The output end of the picosecond pulse laser 1 is arranged with a first reflector 4, the The reflector 4 is installed on the high-precision electric one-dimensional translation platform 12, so that the optical path selection is controlled by the high-precision electric one-dimensional translation platform 12, and the precision of the reci...

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Abstract

The invention provides a double light path green light micropore processing device, which comprises a picosecond pulse laser, a nanosecond pulse laser, a light path calibration system and an optical focusing system, wherein the output end of the picosecond pulse laser is provided with a first reflecting mirror; the output end of the nanosecond pulse laser is provided with a second reflecting mirror; the first reflecting mirror and the second reflecting mirror are connected with a third reflecting mirror; the output end of the third reflecting mirror is provided with an optical shutter; the output end of the optical shutter is connected with a beam expanding lens; the output end of the beam expanding lens is connected with a fourth reflecting mirror; and the fourth reflecting mirror is connected with the optical focusing system through the light path calibration system. The two lasers taking the light pulse length as nanoseconds and picoseconds are adopted, the selection of light beams is controlled by a light path selection system, the use of one laser for the processing is allowed, and the two lasers can also be alternately used during the processing. A double light path system maintains the advantage that the laser processes micropores, and can aim at different processing finenesses and cost requirements to flexibly select processing modes.

Description

technical field [0001] The invention relates to a laser microhole processing system, in particular to a device for finely processing micropores of various materials such as metal, ceramics, plastics, etc. by using a double-light-path green laser. Background technique [0002] At present, laser has been applied in the field of microhole processing. The optical system can focus the laser to a spot smaller than 10um, and the power density at the spot can reach 10 9 ~10 12 W / cm 2 , The material is melted and gasified during processing, thereby forming small holes, the smallest hole diameter can reach about 25um. Compared with the three processing methods of mechanical drill processing, electric discharge processing and etching processing, laser processing technology has significant advantages: it can process micro-holes with a diameter of less than 0.1mm; the processing speed is fast, and thousands of holes can be processed per second , and the hole consistency is good; the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/38B23K26/06B23K26/04B23K26/064B23K26/382
Inventor 赵裕兴郭良
Owner SUZHOU DELPHI LASER
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