Photosensitive composition, photosensitive film, photosensitive layered body, permanent pattern forming method and printed circuit board

A technology of photosensitive composition and photosensitive layer, which is applied in printed circuit, printed circuit manufacturing, microlithography exposure equipment, etc., can solve the problems of no preservation and reduction of preservation, and achieve plating resistance and preservation Excellent, high-sensitivity effects

Inactive Publication Date: 2009-11-25
FUJIFILM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] It is known that S-triazine compounds can improve plating resistance, but the above-mentioned Japanese Patent Application Laid-Open No. 2-173747 does not refer to preservation
If the plating resistance is improved

Method used

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  • Photosensitive composition, photosensitive film, photosensitive layered body, permanent pattern forming method and printed circuit board
  • Photosensitive composition, photosensitive film, photosensitive layered body, permanent pattern forming method and printed circuit board
  • Photosensitive composition, photosensitive film, photosensitive layered body, permanent pattern forming method and printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0473] -Manufacture of photosensitive film-

[0474] On a polyethylene terephthalate film (manufactured by Toray Co., Ltd., 16FB50) with a thickness of 16 μm as a support, a photosensitive composition solution having the following composition was applied and dried. A photosensitive layer with a thickness of 30 μm was formed on the support. A 20-μm-thick polypropylene film (Alphane E-200, manufactured by Oji Special Paper Co., Ltd.) was laminated as a protective layer on the photosensitive layer to produce a photosensitive film.

[0475] Composition of

[0476] The solution of the binder shown in the following formula B-1... 37.2 parts by mass

[0477] A-DPH (manufactured by Shin-Nakamura Chemical Industry Co., Ltd., hereinafter referred to as polymerizable compound “J-1”)………………………………………………… 9.15 parts by mass

[0478] Compound represented by the following formula K-1 (manufactured by Daito Chemical Co., Ltd.) ... 0.63 parts by mass

[0479] DETX (manufactured by Nippon Ka...

Synthetic example 1

[0489] Synthesis of Adhesive B-1

[0490] 90.6 g of 1-methoxy-2-propanol was placed in a 1000 mL three-necked flask, and heated to 90° C. under a nitrogen stream. 105.8 g of benzyl methacrylate, 120.6 g of methacrylic acid in 156 g of 1-methoxy-2-propanol, and 7.24 g of V-601 (manufactured by Wako Pure Chemical Industries) were added dropwise thereto over 3 hours. - 50 g solution in methoxy-2-propanol. After the dropping was terminated, it was heated for an additional hour to make it react. Next, a solution of 20 g of 1-methoxy-2-propanol in 2.00 g of V-601 (manufactured by Wako Pure Chemical Industries, Ltd.) was added dropwise over 1 hour. After the dropwise addition was terminated, the mixture was heated for another 3 hours to make it react, and then the heating was stopped to obtain a copolymer of benzyl methacrylate / methacrylic acid (30 / 70 mol% ratio).

[0491]Next, 105.2 g of glycidyl methacrylate and 20 g of 1-methoxy-2-propanol were added to the dropping funnel, and...

Embodiment 2

[0528] Except that the addition amount of the compound represented by the above formula M-1 in the photosensitive composition solution was changed from 1 mass part to 2 mass parts, a laminated body and a permanent pattern were produced in the same manner as in Example 1, and in the same manner as in Example 1. The protective film detachability, sensitivity, developability (shortest developing time), survivability, and resistance to electroless gold plating were evaluated in a systematic manner. The results are shown in Table 2.

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Abstract

The photosensitive composition provided in the invention characterized by composing (methyl radical) acrylic ester series adhesive, polymerized compound, neutral photopolymerization initiator, thermalcross-linking agent and compound indicated in following general formula (1) in which X means hydrogen atom or substitute with SigmaMu value higher than -0.22.

Description

technical field [0001] The present invention relates to a photosensitive composition, a photosensitive film, a photosensitive laminate, a permanent pattern forming method, and a printed wiring board suitable as a solder resist material for image formation by laser exposure. Background technique [0002] Conventionally, when forming a permanent pattern such as a solder resist, a photosensitive film in which a photosensitive layer is formed by coating a photosensitive composition on a support and drying it has been used. As a method for forming the above-mentioned permanent pattern, for example, on a substrate such as a copper-clad laminate on which a permanent pattern is formed, a photosensitive film is laminated to form a laminate, the above-mentioned photosensitive layer in the laminate is exposed, and after the exposure, the photosensitive layer is exposed. Development is performed to form a pattern, and then a permanent pattern is formed by performing curing treatment or ...

Claims

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Application Information

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IPC IPC(8): G03F7/004G03F7/09G03F7/20H05K3/00
Inventor 有冈大辅池田贵美
Owner FUJIFILM CORP
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