Method for manufacturing micropores for electric conduction among copper foil of high-density multilayer circuit boards

A multi-layer circuit board and manufacturing method technology, applied in the direction of electrical connection formation of printed components, etc., can solve the problems of large discharge of organic and acidic pollutants, low production efficiency, high cost of Excimer lasers, etc.
CN101588679AInactive Publication Date: 2009-11-25XI AN JIAOTONG UNIV
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
XI AN JIAOTONG UNIV
Publication Date
2009-11-25
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention discloses a method for manufacturing micropores for electric conduction among copper foil of high-density multilayer circuit boards. The method comprises: depositing a tin-containing metal layer in a position where a micropore is to be drilled on surface copper foil of a high-density multilayer circuit board by a local electroplating method; using a pulsed carbon dioxide laser microbeam to drill a hole in the position plated with the tin-containing metal layer so as to ensure that the surface copper foil on the bottom of the tin-containing metal layer is melted to form a copper-foil micropore; and aiming the pulsed carbon dioxide laser microbeam at the copper-foil micropore of the surface copper foil to drill a substrate medium hole on a substrate medium under the copper-foil micropore up to interlayer copper foil. The method integrates a drilling process for copper conductive layers with a drilling process for dielectric substrates in the manufacture of the high-density circuit boards, thereby greatly simplifying production process, avoiding the emission of a large number of acidic and organic pollutants and achieving the aims of reducing cost and protecting environment.
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Description

technical field

[0001] The invention belongs to the field of manufacturing high-density printed circuit boards, and relates to an interlayer connection technology in the manufacture of high-density printed circuit boards, in particular to a microhole manufacturing method for conducting electricity between copper foils of high-density multilayer circuit boards. Background technique

[0002] It is a constant technical pursuit to improve integration and reduce product volume and weight in modern electronic manufacturing industry. Various smart and portable electronic devices (such as notebook computers, mobile communications, mobile medical instruments, etc.) are widely used in daily life and national defense construction. Due to the rapid development of large-scale integrated circuit technology, the volume of the circuit board is an important factor restricting the further miniaturization of high-reliability electronic products. So a high-density wiring multilayer circuit boa...

Claims

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