Unlock instant, AI-driven research and patent intelligence for your innovation.

Printed wiring board and method of producing the same

A technology for printed circuit boards and pads, which is used in the manufacture of multilayer circuits, secondary processing of printed circuits, and assembling printed circuits with electrical components. Poor bonding performance, small contact area between wiring and solder mask, etc., to eliminate the difference in wettability, excellent bonding performance, and prevent wiring damage

Inactive Publication Date: 2009-12-02
IBIDEN CO LTD
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] However, in such fine-line wiring, the contact area between the wiring and the solder mask becomes small, and therefore, the bonding performance between the wiring and the solder mask is also degraded.
Especially when the wiring is arranged in the surface layer of the printed circuit board in a state of sparse wiring density, the adhesion performance between the wiring and the solder resist layer is worse
[0009] Also, it is difficult to maintain the strength of the solder bump in the thin wire wiring of the pad, so the solder bump may come off
[0010] Moreover, the present inventors confirmed that if the roughened surface of the fine wire wiring is damaged by oxidation corrosion etc., its adhesiveness with the solder resist layer will be significantly deteriorated.
In particular, when the wiring is provided in the surface layer of the printed circuit board in a dense state, the adhesion performance between the wiring and the solder resist layer will be worse

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Printed wiring board and method of producing the same
  • Printed wiring board and method of producing the same
  • Printed wiring board and method of producing the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0205] Preparation of Starting Compositions for Electroless Plating Adhesives

[0206] (Adhesive for upper layer)

[0207] [Resin composition A]

[0208] 35 parts by weight of a resin solution formed by dissolving 25% cresol novolak type epoxy resin with a molecular weight of 2500, manufactured by Nippon Kayaku Co., Ltd. in a concentration of 80 wt% DMDG, Toa Gosei.Co., Ltd. 3.15 parts by weight of a photosensitive monomer manufactured under the trade name Aronix M315, 0.5 parts by weight of an antifoaming agent manufactured by Sannopuco Co., Ltd. under the name S-65, and 3.6 parts by weight of NMP were mixed under stirring to prepare the resin Composition A.

[0209] [Resin composition B]

[0210] 12 parts by weight of polyethersulfone (PES), manufactured by Sanyo Kasei Co., Ltd under the trade name Polymerpole, 7.2 parts by weight of epoxy resin particles with an average particle size of 1.0 μm, and the same resin with an average particle size of 0.5 μm 3.09 parts by...

Embodiment 2

[0272] Figure 33 is a cross-sectional view of the printed circuit board 44 . The manufacturing steps of this example are basically the same as the manufacturing steps in Example 1, except that the rough surface of the wiring surface layer used by the pad is covered with a metal layer 51, as in step (17). Figure 9 to Figure 12 shown. The metal can be nickel, and the metal film layer is formed by electroless plating. The nickel layer thus formed had a thickness of 0.04 µm.

[0273] In this example, on the solder resist layer 38, pass through the nickel-plated layer 52 on the nickel layer 51, and on the opening part of the gold-plated layer 53 on it, form a solder bump (solder body) 54, as steps (18) to (21) Figure 33 shown.

Embodiment 3

[0275] This example is basically the same as Example 2, except that the tin layer of displacement plating is used instead of the nickel layer of electroless plating as the metal layer on the wiring rough surface for covering pads. The tin layer is 0.03 μm thick.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

This invention provides a printed wiring board and a method of producing the same. The printed wiring board (39) comprising conductor circuits (31) for solder pad and a solder resist layer (38) formed on the conductor circuit (31) for solder pad, wherein the solder resist layer (38) is formed in opening portions (37, 36) to be provided with a solder body. In the printed wiring board (39) according to the invention, the conductor circuit (31) for solder pad has a roughened surface (32) treated with an etching solution containing copper (II) complex and organic acid, and the solder resist layer (38) is formed on the roughened surface (32). In the printed wiring board according to the invention, the adhesion property between fine wired conductor circuit and solder resist layer is enhanced, and the conductor circuit and the solder resist layer are strongly adhered to each other without peeling even in solder bump forming portions and bad continuity is not caused in the solder bump forming portion.

Description

[0001] This application is a divisional application based on the application dated July 1, 1999, application number 99810416.7, and the title of the invention is "printed circuit board and its manufacturing method". technical field [0002] The present invention relates to a printed circuit board, and more particularly to a printed circuit board capable of improving the bonding performance and bonding strength between wiring for pads, a solder mask and solder bumps, and a method of manufacturing the same. Background technique [0003] In recent years, so-called composite multilayer circuit boards have received great attention from the viewpoint of the high-density demand for multilayer circuit boards. Such a composite multilayer circuit board is produced, for example, by the method disclosed in JP-B-4-55555. [0004] In this method, a photosensitive adhesive for electroless plating is applied to a substrate core, dried, exposed and developed to form an interlayer insulating ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/38H05K3/34H05K3/24H05K3/46
Inventor 袁本镇钟晖
Owner IBIDEN CO LTD