Test structure for measuring thermal conductivity of film
Patent Information
- Authority / Receiving Office
- CN Β· China
- Current Assignee / Owner
- UNIV OF ELECTRONIC SCI & TECH OF CHINA
- Publication Date
- 2010-01-06
- Estimated Expiration
- Not applicable Β· inactive patent
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Abstract
Description
Technical field
[0001] The invention relates to the technical field of microelectronics, in particular to a test structure for testing the thermal conductivity of a thin film. Background technique
[0002] With the rapid development of semiconductor technology and MEMS technology, the size of the device has entered the micro / nano scale. Silicon nitride film is an important film material, which is widely used in semiconductor devices, MEMS devices, and optical devices. As silicon nitride (Si 3 N 4 ) The film has the characteristics of compact structure, high dielectric coefficient, and has the ability to prevent the diffusion of water and sodium ions and the ability to resist oxidation, so it is often used as a surface passivation layer for large-scale integrated circuits and very large-scale integrated circuits. Wait. Because the silicon nitride film has good mechanical strength, it can be used as a supporting structure for the microbridge in the infrared detector. Among them,...