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Metal structure electrostatic-driven MEMS relay and preparation method thereof

An electrostatic drive, metal structure technology, applied in the direction of electrostatic relays/electro-adhesion relays, relays, microstructure technology, etc., can solve the problems of high driving voltage, unable to load current, small heat capacity, etc., and achieve high yield and consistent process Good performance and low driving voltage

Active Publication Date: 2010-02-03
北京同方华创科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] 1. The driving voltage required by general MEMS relays is relatively large, which has a certain gap with the standard voltage of 5V on integrated circuits. How to reduce the driving voltage while ensuring a small opening and closing gap is one of the difficult problems in research.
[0006] 2. Due to the small size of the MEMS relay, its heat capacity is small, so generally it cannot load a large current, which limits its application range to a certain extent, so increasing the load current of the MEMS relay is also The focus of the research

Method used

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  • Metal structure electrostatic-driven MEMS relay and preparation method thereof
  • Metal structure electrostatic-driven MEMS relay and preparation method thereof
  • Metal structure electrostatic-driven MEMS relay and preparation method thereof

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Embodiment Construction

[0050] The metal of the MEMS relay structure is formed by an electroplating process, including two parts of a structural support layer and a surface structure layer. Specifically, a metal seed layer and a barrier layer (transition layer) are formed on the substrate surface through techniques such as sputtering and evaporation. ), the adhesion layer, the materials include Ti / Pt / Au, Cr / Au, Ti / Cu, Ta / TaN / Cu, Ru, Ir or alloy materials and other metal materials. The first requirement for the seed layer is a conductor. In addition, the seed layer needs to have good adhesion and stable temperature characteristics between the seed layer and the substrate, such as Ti. The structure can be formed by electroplating, and the electroplating materials include metal materials such as Cu and Au.

[0051] Structural part:

[0052] The electrostatically driven relay structure can be divided into a driving part (upper plate 7 , lower plate 4 ) and a contact electrode 6 . The upper plate is mai...

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Abstract

The invention relates to a metal structure electrostatic-driven MEMS relay and a preparation method thereof, belonging to the technical field of design and manufacture of relays. The metal structure electrostatic-driven MEMS relay is characterized in that the relay is a structure which is fixed and supported at two ends and is divided into an upper active pole plate 7 and a lower fixed pole plate4, the upper active pole plate is referred to as an upper pole plate, the lower fixed pole plate is referred to as a lower pole plate, and the pole plates are both made of metal, thereby being capableof reducing contact resistance. A damping hole 9 is formed on the upper pole plate, thereby being capable of reducing damping effect during switching-on and switching-off, simultaneously being conductive to releasing a sacrificial layer 8, ensuring integrity of the structure and preventing the emergence of turnover roll failure when releasing the structure. The lower pole plate adopts an upper insulating material layer 5 and a lower insulating layer 3 for integral coating, thereby being capable of effectively preventing the conduction of the upper pole plate and the lower pole plate after contact and ensuring the upper pole plate and a substrate to be insulated. The MEMS relay is characterized by low driving voltage and great load current, thereby being widely applied in the fields of electronic information, industrial control, energy management, transportation, communication, aerospace and military.

Description

technical field [0001] The invention belongs to the field of relay manufacturing technology, and in particular relates to a metal structure electrostatically driven MEMS relay with low driving voltage characteristics and high carrying current characteristics and a preparation method thereof. Background technique [0002] The relay is an important control element, which has the functions of isolating input and output circuits, switching signals / loads, and blocking circuits. As a basic electromechanical element, it is widely used in various power protection, energy management instruments and automatic control systems. . Relays of various specifications and types are required to be used in national defense weapons, aerospace and various ground control equipment. This application requires the relay to have high reliability, strong current carrying capacity when closed, small open circuit leakage current, and small contact resistance. Requires small size, light weight, fast resp...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01H59/00H01H11/00B81C1/00
Inventor 阮勇尤政杨建中李滨张高飞王晓峰董瑛
Owner 北京同方华创科技有限公司
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