Metal structure electrostatic-driven MEMS relay and preparation method thereof
An electrostatic drive, metal structure technology, applied in the direction of electrostatic relays/electro-adhesion relays, relays, microstructure technology, etc., can solve the problems of high driving voltage, unable to load current, small heat capacity, etc., and achieve high yield and consistent process Good performance and low driving voltage
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[0050] The metal of the MEMS relay structure is formed by an electroplating process, including two parts of a structural support layer and a surface structure layer. Specifically, a metal seed layer and a barrier layer (transition layer) are formed on the substrate surface through techniques such as sputtering and evaporation. ), the adhesion layer, the materials include Ti / Pt / Au, Cr / Au, Ti / Cu, Ta / TaN / Cu, Ru, Ir or alloy materials and other metal materials. The first requirement for the seed layer is a conductor. In addition, the seed layer needs to have good adhesion and stable temperature characteristics between the seed layer and the substrate, such as Ti. The structure can be formed by electroplating, and the electroplating materials include metal materials such as Cu and Au.
[0051] Structural part:
[0052] The electrostatically driven relay structure can be divided into a driving part (upper plate 7 , lower plate 4 ) and a contact electrode 6 . The upper plate is mai...
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