Metal-resin laminate
A technology of laminates and resin layers, applied in the direction of metal layered products, coatings, layered products, etc., can solve the problems of high hygroscopic expansion coefficient, low polymer molecular orientation, poor adhesion, etc. Good adhesion and excellent dimensional stability
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no. 1 approach
[0079] As the first embodiment of the present invention, the molecule of the thermoplastic polyimide contains repeating unit A derived from tetracarboxylic dianhydride represented by general formula (1), tetracarboxylic acid represented by general formula (2) The repeating unit B of the dianhydride and the repeating unit C of the tetracarboxylic dianhydride represented by the general formula (3) are at least two or more.
[0080] [chemical 13]
[0081]
[0082] (In formula (1), R 1 represents hydrogen, an alkyl group having 1 to 6 carbon atoms, or an alkoxy group having 1 to 6 carbon atoms, and n represents an integer of 2 or more),
[0083] [chemical 14]
[0084]
[0085] (In formula (2), R 2 is C 1 ~C 6 Alkyl, C 1 ~C 6 the alkoxyl group),
[0086] [chemical 15]
[0087]
[0088] In the above general formula (1), the repeating unit A is preferably represented by n=2 to 4, more preferably 2 What is represented by -3 is more preferably derived from the tetrac...
Embodiment 1
[0192] 1.22 g (3.0 mmol) of 2,2-bis(4-(4-aminophenoxy)phenyl)propane (BAPP) and N - 14.1 g of methyl-2-pyrrolidone (dehydrated) (manufactured by Wako Pure Chemical Industries, Ltd.) (hereinafter, NMP) was stirred and dissolved at room temperature. Then add 2,5-benzylidene bis(trimellitic acid monoester) dianhydride (hereinafter referred to as TAMHQ) 1.42g (3.0mmol), cover tightly with the lid that nitrogen inlet pipe is installed, use magnetic stirrer, in Under nitrogen stream, it stirred at room temperature for 1 hour, and it was made to react, and the solution (varnish) of the thermoplastic polyimide precursor with a density|concentration of 15 weight% was obtained. This varnish was further diluted by 150% with NMP to obtain a 10% by weight varnish.
[0193] The resulting concentration of 10% by weight varnish was coated on a polyimide film kept on a smooth plate kept at 80° C. using #22 wire rod manufactured by R.D. Specialties in the U.S. (trade name Apicar (registered tr...
Embodiment 2
[0197] In addition to using a mixture of TAMHQ0.85g (1.8mmol) and p-phenylene bis(trimellitic acid monoester) dianhydride (hereinafter referred to as TAHQ) 0.55g (1.2mmol) instead of TAMHQ1.42g as tetracarboxylic dianhydride Except for the others, the same operations as in Example 1 were carried out to obtain a copper foil-resin laminate and a thermoplastic polyimide film. The peel strength of the obtained copper foil-resin laminate was measured by the method described above. Moreover, the hygroscopic expansion coefficient in 10%RH - 80%RH of the thermoplastic polyimide produced using the varnish with a density|concentration of 15 weight% was 12.5ppm / %RH. Also, the coefficient of thermal expansion was 60 ppm / °C.
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Abstract
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