Halogen-less high frequency resin composition, and prepreg and laminate manufacturing by using same

一种树脂组合物、预浸料的技术，应用在合成树脂层状产品、织物、涂层等方向，能够解决磷系阻燃剂易吸水、水敏感、材料吸水率大等问题，达到优异耐热性、低吸水率、低介电常数的效果

Active Publication Date: 2010-03-31
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, after the epoxy resin is cured by acid anhydride, the material inevitably contains a large number of hydrophilic groups, resulting in a large water absorption rate of the material. Therefore, the cured epoxy resin is very sensitive to water under high temperature and high humidity conditions.
In addition, phosphorus flame retardants are easy to absorb water

Method used

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  • Halogen-less high frequency resin composition, and prepreg and laminate manufacturing by using same
  • Halogen-less high frequency resin composition, and prepreg and laminate manufacturing by using same

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Embodiment Construction

[0017] The present invention relates to a halogen-free flame-retardant resin composition, which contains, in parts by weight of organic solids:

[0018] (A) Styrene-maleic anhydride oligomer, 10-50 parts by weight;

[0019] (B) At least one compound having a dihydrobenzoxazine ring, 10-50 parts by weight;

[0020] (C) At least one polyepoxy compound, 10-50 parts by weight;

[0021] (D) Phosphorus-containing flame retardant, 5-30 parts by weight.

[0022] The components are described in detail below.

[0023] The component (A) described in the present invention is a styrene-maleic anhydride (SMA) oligomer, which can further improve the thermal and electrical properties of polymers and products. The selected SMA has a molecular weight of 1400 to 50,000. The recommended SMA oligomer content range is 1400-14400. Such as the commercially available SMA1000, SMA2000, SMA EF-30, EF-40, EF-60 and EF-80. The SMA can be used alone or in combination, and the recommended dosage is 10-50 parts by ...

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Abstract

The invention relates to a halogen-less high frequency resin composition, and a prepreg and a laminate manufactured by using the same. The halogen-less high frequency resin composition comprises the following components based on weight part of the organic solids: (A) 10 to 50 parts of styrene-maleic anhydride oligomer; (B) 10 to 50 parts of at least one compound containing dihydro-benzoxazine ring; (C) 10 to 50 parts of at least one polyepoxide; and (D) 5 to 30 parts of at least one phosphorus-containing flame retardant. The prepreg and the laminate manufactured by using the halogen-less highfrequency resin composition has low dielectric constant, low dielectric loss factor, high glass transition temperature, good heat resistance, low water absorbance, and simple and convenient technological operation.

Description

Technical field [0001] The invention relates to a resin composition, in particular to a halogen-free high-frequency resin composition and prepregs and laminates made of the same. Background technique [0002] For a long time, laminates for printed circuits usually use halogen flame retardants to achieve flame retardancy. When this halogen flame retardant burns, it not only emits large amounts of smoke and smells, but also produces highly corrosive halogenation. Hydrogen gas. According to literature reports, in recent years, halogen-containing flame retardants will produce carcinogens such as dioxins and dibenzofurans during high-temperature cracking and combustion. Therefore, following the EU’s "Directive on Waste Electrical and Electronic Equipment" and "Regarding The Directive on Restriction of the Use of Hazardous Substances in Electrical and Electronic Equipment was officially implemented on July 1, 2006. The development of halogen-free flame-retardant printed circuit lamina...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L35/06C08L79/04C08L63/00C08K5/521C08K5/5399C08K5/53C08J5/24B32B27/04
CPCC08J5/24C08L2203/206C08K5/49C08J2325/08C08K5/357C08L2201/02C08L63/00C09D135/06C08J2363/00C08L2203/20Y10T428/31515Y10T428/24994Y10T442/2721C08J5/249C08L35/06
Inventor 苏世国何岳山王碧武李杰程涛
Owner GUANGDONG SHENGYI SCI TECH
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