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Method for preparing microcapsule adhesive used for novel heat-preserving and sound-insulating building coating

A technology for thermal insulation and sound insulation and architectural coatings, which is applied to the preparation of microcapsule preparations, adhesives, and microspheres. It can solve the problems of poor thermal insulation and sound insulation effects of coating coatings, poor thermal insulation and sound insulation effects of adhesives, and no thermal insulation and sound insulation properties. The effect of increasing flexibility, economical benefits, and large market potential

Inactive Publication Date: 2010-05-12
GUANGDONG OCEAN UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, adhesives for architectural and decorative coatings at home and abroad generally do not have thermal insulation and sound insulation properties or have poor thermal insulation and sound insulation effects.
For some architectural coatings, materials with good thermal insulation and sound insulation effects are added, but due to the poor thermal insulation and sound insulation effect of the adhesive, the thermal insulation and sound insulation effect of the paint coating is not good.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] Embodiment 1 Novel thermal insulation and sound insulation building coating microcapsule adhesive formula

[0027] Core material: air, orifice diameter: 1.6 microns, pressure: 3000-3200 Pa, continuous flow for 45 minutes: wall material: melamine 30g, emulsifier: Span-601g, formaldehyde 60ml, ethanol 60ml

Embodiment 2

[0028] Embodiment 2 Microcapsule emulsion formulation for novel thermal insulation and sound insulation building coating

[0029] Core material: carbon dioxide, orifice diameter: 1.6 microns, pressure: 3000-3200 Pa, continuous flow for 45 minutes; wall material: melamine 30g, emulsifier: Span-601g, formaldehyde 60ml, ethanol 60ml

Embodiment 3

[0030] Embodiment 3 The preparation of microcapsule emulsion for novel thermal insulation and sound insulation architectural coating:

[0031] (1) Polymer: Take 60g melamine + 120ml (36%) formaldehyde + 40ml water, slowly heat up to 65°C until the solution is clear, add 120ml ethanol and continue to stir for 10 minutes, then set aside for later use.

[0032] (2) Dissolution of the emulsifier: Take 1g of Span-60, dissolve it in 45ml of water, slowly raise the temperature to 90°C, and stir until it dissolves.

[0033] (3) Bubble formation from sharp holes: Take the above solution and ventilate it for 45 minutes under stirring at 60°C.

[0034] (4) Polycondensation into capsules: under stirring at 60°C, add 40ml of prepolymer to the above solution and react for 30 minutes, add 40ml of prepolymer, heat up to 80°C, after the solution turns white, add 30ml of prepolymer, continue Stir to make the solution thicken, lower the temperature to 60°C and continue stirring for 30 minutes. ...

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Abstract

The invention provides a method for preparing a microcapsule adhesive used for novel heat-preserving and sound-insulating building coating. The method comprises the following steps: under proper pressure, overflowing the gas or greenhouse gas with good heat insulation performance into water solution containing emulsifying agent naturally through an orifice, and mixing the solution so as to form round bubbles uniformly; and subsequently adopting an emulsion polycondensation technology to lead the melamine wall material to form a capsule by polycondensation, thus preparing the microcapsule adhesive used for the coating. The invention also discloses a microcapsule adhesive used for the novel heat-preserving and heat-insulating building coating. The invention has heat preservation, sound insulation and energy-saving performances, meets the environmental protection requirement, has good smoothness and large viscosity, is economical and has large market potential.

Description

technical field [0001] The invention belongs to the preparation of a novel microcapsule adhesive for thermal insulation and sound insulation architectural coatings. Background technique [0002] At present, adhesives for construction and decorative coatings at home and abroad generally do not have thermal insulation and sound insulation properties or have poor thermal insulation and sound insulation effects. For some architectural coatings, materials with good thermal insulation and sound insulation effects are added, but due to the poor thermal insulation and sound insulation effect of the adhesive, the thermal insulation and sound insulation effect of the paint coating is not good. Therefore, it is imperative to develop adhesives for architectural coatings with good thermal insulation and sound insulation effects. Contents of the invention [0003] One of the technical problems to be solved by the present invention is the formation of microbubbles through sharp holes an...

Claims

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Application Information

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IPC IPC(8): C09J161/28C09D161/28C09D5/00B01J13/02
Inventor 万义玲孙美红
Owner GUANGDONG OCEAN UNIVERSITY
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