Technology for improving welding strength of PV ribbon by plating Ni/V layer via mask

Abstract

The invention discloses a technology for improving welding strength of PV ribbon by plating an Ni/V layer via a mask, comprising the following steps: before an Ni/V membrane is plated, a layer of mask plate covers the position to be welded with the PV ribbon on a thin film a-Si/mu c-Si tandem solar cell to enable the covered position not to be plated by the Ni/V metal membrane, and the mask plate is removed to enable the position to be welded with the PV ribbon to retain an Ag metal membrane. The invention has the advantages that compared with the conventional PVD coating film, the Ag metal membrane is exposed from the position to be welded with the PV ribbon; Ag has better metallic conductivity and is not easy to generate an oxide layer under high temperature; the outer surface tin-plating layer of he PV ribbon also contains the Ag component; and with the help of flux, the Ag metal membrane is easy to be welded firmly with the PV ribbon and has better conductivity.

Description

technical field [0001] The invention relates to a PVD (Physical Vapor Deposition, physical vapor deposition) coating process for an amorphous-microcrystalline laminated thin film battery, in particular to a process for improving the welding strength of a tin-plated copper strip for an amorphous-microcrystalline laminated thin film battery. Background technique [0002] At present, the back electrode of the amorphous microcrystalline thin film solar panel adopts the metal film structure of TCO (transparent conductive oxide, transparent conductive oxide) plus Ag (silver) plus Ni (nickel) / V (vanadium). This structure only needs one PVD can be realized, and there is no need to stop during the coating process. Doping V in the Ni metal film can remove oxygen and help the welding of the Ni metal film and the tin-plated copper strip. At the same time, Ni is also a metal with excellent corrosion resistance, which can effectively protect inner metal film layer. [0003] However, in t...

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Problems solved by technology

[0003] However, in this method, when tin-plated copper strips are used for welding on the metal layer of the thin-film battery board, it is found that the welding strength between the Ni / V layer and the tin-plated copper strips is not strong enough. When the PVD method is used to plate the metal film of the back electrode of the battery board, the last metal film uses a Ni / V target material, and the film layer is relatively thin. Although the Ni / V film can effectively protect the internal Ag film layer, it cannot When the copper strip is welded to the Ni / V metal film layer by spot welding, the peel strength of the solder joint is not enough

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