Recycle treatment method for wafer rinse waste liquor

A technology for cleaning and processing silicon wafers, which is applied in the fields of energy waste water treatment, water softening, permeation/dialysis water/sewage treatment, etc. It can solve the problems of waste of resources and high cost, save costs, reduce environmental pollution, and realize resources effect of processing

Inactive Publication Date: 2010-07-21
HANGZHOU TIAN CHUANG ENVIRONMENTAL TECH
View PDF3 Cites 23 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there is no report on the recycling of cutting and cleaning wastewater. Currently, sedimentation, air flotation,

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0010] Embodiment 1: a kind of recycling processing method of silicon chip cleaning liquid, (1) the cleaning waste liquid of silicon chip cutting carries out softening treatment after preliminary filtration, and described softening treatment is lime softening, lime-soda ash softening, resin softening One or more combinations; (2) After removing mechanical impurities and viscous substances through one or a combination of microfiltration membranes and ultrafiltration membranes, enter a multi-stage membrane separation device to obtain pure water and polyethylene glycol solutions, The microfiltration membrane and ultrafiltration membrane are one or more of tubular membranes, hollow fiber membranes, roll membranes, and flat membranes, and their materials can be polypropylene, ceramics, polyvinylidene fluoride, polyamide, and metal; The multi-stage membrane separation device is one or several combinations of electrodialysis membrane, reverse osmosis membrane, and nanofiltration membr...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to a treatment method for rinse waste water of silicon wafer cutting, which not only can fully recover and utilize polyethylene glycol and water in waste water, but also can reduce the treatment amount of the waste water to realize resource recovery. The method comprises the following steps: preliminarily filtering the rinse waste water of the silicon wafer cutting, carrying out softening process, filtering to remove mechanical impurities and sticky materials by one or the combination of a microfiltration membrane and a superfiltration membrane, entering a multi-level membrane separation device to obtain pure water and polyethylene glycol solution, and refining the polyethylene glycol solution to obtain polyethylene glycol the mass percent of which is larger than 95%. The invention has the advantages that the obtained pure water can be used for the rinse waste water of the silicon wafer cutting and the obtained polyethylene glycol is used for the preparation of cutting fluid of the silicon wafer; by the implementation of the invention, water can be recycled, and the polyethylene glycol in the waste water also can be recycled, thus realizing the source treatment of the waste water, greatly saving the cost, reducing the environmental pollution for silicon wafer manufacturing enterprises, and having considerable economic benefit and social benefit.

Description

technical field [0001] The invention relates to a treatment method for silicon wafer cutting and cleaning wastewater, which can fully recycle and utilize polyethylene glycol and water in wastewater, reduce the amount of wastewater treatment, and realize resource recovery, and belongs to the field of silicon wafer cutting wastewater treatment technology. Background technique [0002] Monocrystalline silicon wafers and polycrystalline silicon wafers are indispensable raw materials for solar cells and semiconductors. As the most potential energy source in the 21st century, the solar energy industry has great potential for development. As an emerging sunrise industry, coupled with a good policy environment and the characteristics of the industry itself, the solar cell industry has high investment value and development potential. In recent years, my country's silicon industry has developed rapidly, especially the silicon wafer industry. The environmental problems brought about b...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): C02F1/44C02F5/02C08G65/26
CPCY02W10/37
Inventor 赵经纬邱晖朱俊峰
Owner HANGZHOU TIAN CHUANG ENVIRONMENTAL TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap