Preparation method of cold pressing sintered diamond millstone
A diamond and grinding disc technology, which is applied in metal processing equipment, grinding/polishing equipment, grinding devices, etc., can solve the problems of long production cycle, complicated manufacturing process, and expensive price, and achieve high cost, simple process, and sharp good effect
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Embodiment 1
[0019] Embodiment 1: Prepare cutter head green body and matrix according to conventional technology respectively; Take copper-based solder raw material according to following proportioning (mass ratio): Cu 80, AL 2, Sn 7, Mn 1, Pb 2, above-mentioned raw material Using atomized powder metallurgy technology to make copper-based solder alloy powder, the powder particle size is -300 mesh, hydrogen loss ≤ 0.13%, loose ratio 3.3±0.3g / cm3; according to the mass ratio of liquid paraffin: copper-based solder is 1: Mix the two into a viscous shape at a ratio of 2, and apply it evenly on the transition layer of the green cutter head, and then position it through the tooling, use the graphite mold as the carrier, put the green cutter head and the base body into the tube furnace Under a reducing atmosphere, sintering at a high temperature of 850°C for 70 minutes completes the connection between the cutter head and the substrate at one time.
Embodiment 2
[0020] Embodiment 2: prepare cutter head green body and substrate according to conventional technology respectively; Take copper-based solder raw material according to following proportioning (mass ratio): Cu 90, AL 2, Sn 10, Mn 5, Pb 5, above-mentioned raw material Using atomized powder metallurgy technology to make copper-based solder alloy powder, the powder particle size is -300 mesh, hydrogen loss ≤ 0.13%, loose ratio 3.3±0.3g / cm3; according to the mass ratio of liquid paraffin: copper-based solder is 1: Mix the two into a viscous shape at a ratio of 2, and apply it evenly on the transition layer of the green cutter head, and then position it through the tooling, use the graphite mold as the carrier, put the green cutter head and the base body into the tube furnace Under a reducing atmosphere, sintering at a high temperature of 890°C for 60 minutes completes the connection between the cutter head and the substrate at one time.
Embodiment 3
[0021] Embodiment 3: Prepare cutter head green body and substrate according to conventional technology respectively; Take copper-based brazing material raw material according to following proportioning (mass ratio): Cu 85, AL 2, Sn 5, Mn 3, Pb 1, above-mentioned raw material Using atomized powder metallurgy technology to make copper-based solder alloy powder, the powder particle size is -300 mesh, hydrogen loss ≤ 0.13%, loose ratio 3.3±0.3g / cm3; according to the mass ratio of liquid paraffin: copper-based solder is 1: Mix the two into a viscous shape at a ratio of 2, and apply it evenly on the transition layer of the green cutter head, and then position it through the tooling, use the graphite mold as the carrier, put the green cutter head and the base body into the tube furnace Under a reducing atmosphere, sintering at a high temperature of 920°C for 50 minutes completes the connection between the cutter head and the substrate at one time.
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