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Preparation method of cold pressing sintered diamond millstone

A diamond and grinding disc technology, which is applied in metal processing equipment, grinding/polishing equipment, grinding devices, etc., can solve the problems of long production cycle, complicated manufacturing process, and expensive price, and achieve high cost, simple process, and sharp good effect

Active Publication Date: 2010-08-04
BOSUN TOOLS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the prior art, the commonly used method is that the diamond segment is sintered in vacuum hot pressing equipment, the disadvantage is that the mold loss is large and the production cost is high; the connection technology between the segment and the substrate adopts high-frequency induction brazing, and the brazing material uses Expensive silver-based solder tabs
The existing diamond grinding discs have complex manufacturing process and long production cycle, which makes the overall cost performance of the prepared diamond grinding discs low

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] Embodiment 1: Prepare cutter head green body and matrix according to conventional technology respectively; Take copper-based solder raw material according to following proportioning (mass ratio): Cu 80, AL 2, Sn 7, Mn 1, Pb 2, above-mentioned raw material Using atomized powder metallurgy technology to make copper-based solder alloy powder, the powder particle size is -300 mesh, hydrogen loss ≤ 0.13%, loose ratio 3.3±0.3g / cm3; according to the mass ratio of liquid paraffin: copper-based solder is 1: Mix the two into a viscous shape at a ratio of 2, and apply it evenly on the transition layer of the green cutter head, and then position it through the tooling, use the graphite mold as the carrier, put the green cutter head and the base body into the tube furnace Under a reducing atmosphere, sintering at a high temperature of 850°C for 70 minutes completes the connection between the cutter head and the substrate at one time.

Embodiment 2

[0020] Embodiment 2: prepare cutter head green body and substrate according to conventional technology respectively; Take copper-based solder raw material according to following proportioning (mass ratio): Cu 90, AL 2, Sn 10, Mn 5, Pb 5, above-mentioned raw material Using atomized powder metallurgy technology to make copper-based solder alloy powder, the powder particle size is -300 mesh, hydrogen loss ≤ 0.13%, loose ratio 3.3±0.3g / cm3; according to the mass ratio of liquid paraffin: copper-based solder is 1: Mix the two into a viscous shape at a ratio of 2, and apply it evenly on the transition layer of the green cutter head, and then position it through the tooling, use the graphite mold as the carrier, put the green cutter head and the base body into the tube furnace Under a reducing atmosphere, sintering at a high temperature of 890°C for 60 minutes completes the connection between the cutter head and the substrate at one time.

Embodiment 3

[0021] Embodiment 3: Prepare cutter head green body and substrate according to conventional technology respectively; Take copper-based brazing material raw material according to following proportioning (mass ratio): Cu 85, AL 2, Sn 5, Mn 3, Pb 1, above-mentioned raw material Using atomized powder metallurgy technology to make copper-based solder alloy powder, the powder particle size is -300 mesh, hydrogen loss ≤ 0.13%, loose ratio 3.3±0.3g / cm3; according to the mass ratio of liquid paraffin: copper-based solder is 1: Mix the two into a viscous shape at a ratio of 2, and apply it evenly on the transition layer of the green cutter head, and then position it through the tooling, use the graphite mold as the carrier, put the green cutter head and the base body into the tube furnace Under a reducing atmosphere, sintering at a high temperature of 920°C for 50 minutes completes the connection between the cutter head and the substrate at one time.

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Abstract

The invention provides a preparation method of a cold pressing sintered diamond millstone, belongs to the technical field of powder metallurgy, and the method is used for solving the problems of complicate process and high cost of the diamond millstone. The technical scheme comprises preparation of powder, cold press molding of a tool bit green-pressing, preparation of a matrix and other processes. The method is characterized by comprising the following steps: selecting the prepared tool bit green-pressing and the matrix, evenly coating copper base brazing filler metals on the surface of the transition layer of the tool bit green-pressing; tooling and positioning; under the atmosphere of reduction, putting the tool bit green-pressing and the matrix into a tube furnace, sintering for 50-70min at the temperature of 850-920 DEG C, and completing the linkage of the tool bit and the matrix in one time. The method of the invention discards the traditional high-frequency dielectric welding linkage process of the tool bit and the matrix, replaces silver brazing alloys with the copper base brazing filler metals with large price advantage, continually sinters by cold pressing under the atmosphere of reduction in the tube furnace, integrates the working procedures of sintering and wielding of the tool bit into a whole; and under the premise of the guarantee of the associative strength ofthe tool bit and the matrix, the method better solves the problems of high braze millstone cost and complicate production process.

Description

technical field [0001] The invention relates to a method for preparing a diamond tool, in particular to a method for preparing a cold-pressed sintered diamond grinding disc used for grinding building materials such as stone, and belongs to the technical field of powder metallurgy. Background technique [0002] Diamond grinding discs are tools used for grinding stone and other hard building materials in the field of construction and decoration. With the rapid development of economic construction, the market demand for diamond grinding discs is gradually increasing. The diamond grinding disc is composed of a diamond cutter head and a substrate. During the production process, the diamond cutter head and the substrate are prepared separately, and then the diamond cutter head is fixed on the substrate by welding. In the prior art, the commonly used method is that the diamond segment is sintered in vacuum hot pressing equipment, the disadvantage is that the mold loss is large and ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24D18/00
Inventor 袁一飞王成军时会彬王凯苏士伟王咏梅王丽娟
Owner BOSUN TOOLS CO LTD