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Chemical nickel-plating stabilizer and chemical nickel plating solution

An electroless nickel plating solution and electroless nickel plating technology, applied in liquid electroless plating, metal material coating process, coating and other directions, can solve the difficulty of controlling and replenishing the content of composite stabilizer, losing stabilizer, reducing the coating resistance. Corrosion and wear resistance, etc., to achieve the effect of excellent stability, wide application and convenient access.

Inactive Publication Date: 2010-09-15
深圳市华傲创表面技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Lead is a stabilizer with excellent physical and chemical properties. However, due to the European Union's ELV (End-of-Life Vehicle Directive), RoHS (Restriction of Hazardous Substances), WEEE (Waste of Electrical and Electronic Equipment) and other related environmental protection requirements , and the harm to the human body due to the environmental problems caused by lead, lead is no longer suitable for the electroless nickel deposition process.
For +2 valence tin, because it is easily oxidized from +2 valence to +4 valence (Sn2+→Sn4+), it will lose the stability of the stabilizer function, which has the potential to render the entire electroless nickel process ineffective
In addition, sulfide stabilizers often increase the internal stress and porosity of the coating, reduce the ductility of the coating, and reduce the corrosion resistance and wear resistance of the coating.
At present, there are some composite stabilizers compounded by unsaturated organic acids, inorganic salts and sulfur-containing compounds, which have good synergistic effects, but it is difficult to control and supplement the content of composite stabilizers in the production process of electroless nickel plating.

Method used

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  • Chemical nickel-plating stabilizer and chemical nickel plating solution
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  • Chemical nickel-plating stabilizer and chemical nickel plating solution

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0092] In the chemical nickel plating process for plastics, the chemical nickel solution is prepared according to the following formula. The activated and sensitized plastic is immersed in the chemical nickel solution at 32°C for 15 minutes and then taken out to obtain a uniform, smooth, continuous, Strongly bonded nickel-plated plastic. The performance test of this nickel coating is as described in Table 1. It can be seen from Table 1 that the plating rate of the chemical nickel solution in this embodiment is fast, up to 12 μm / h, the cycle period is long, up to 6 cycles, and the bonding force reaches an excellent level.

[0093] The formula of chemical nickel solution is as follows:

[0094] Nickel sulfate: 25g / L

[0095] Sodium hypophosphite: 25g / L

[0096] Nickel chloride: 25g / L

[0097] Ammonium citrate: 25g / L

[0098] Potassium antimony tartrate makes antimony: 6ppm

[0099] 50% ammonia water and 10% sulfuric acid: adjust the pH value of the electroless nickel plating...

Embodiment 2

[0103] In the chemical nickel plating process for plastics, the chemical nickel solution is prepared according to the following formula, and the plastic that has been activated and sensitized is immersed in the chemical nickel solution for 90 minutes at 25°C, and then taken out to obtain a uniform, smooth, continuous, Strongly bonded nickel-plated plastic. The performance of the nickel coating is similar to that shown in Table 1.

[0104] The formulation of chemical nickel solution for plastic electroplating is as follows:

[0105] Nickel sulfate: 5g / L

[0106] Sodium hypophosphite: 5g / L

[0107] Nickel chloride: 50g / L

[0108] Ammonium citrate: 50g / L

[0109] Bismuth citrate: 2ppm

[0110] 50% ammonia water: adjust the pH value of the electroless nickel plating solution to 8.0.

Embodiment 3

[0112] In the chemical nickel plating process for plastics, the chemical nickel solution is prepared according to the following formula, and the plastic that has been activated and sensitized is immersed in the chemical nickel solution at 40°C for 60 minutes and then taken out to obtain a uniform, smooth, continuous, Strongly bonded nickel-plated plastic. The performance of the nickel coating is similar to that shown in Table 1.

[0113] The formula of chemical nickel solution is as follows:

[0114] Nickel sulfate: 50g / L

[0115] Sodium hypophosphite: 50g / L

[0116] Nickel chloride: 5g / L

[0117] Ammonium citrate: 5g / L

[0118] Potassium antimony tartrate and

[0119] Mixture of bismuth trioxide: 10ppm

[0120] 50% ammonia water: adjust the pH value of the electroless nickel plating solution to 10.0.

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Abstract

The invention discloses chemical nickel-plating stabilizer and three chemical nickel plating solution. The chemical nickel-plating stabilizer is soluble antimony compound and / or bismuth compound, and the three chemical nickel plating solution are alkaline chemical nickel electroplating plating solution for the plastic, acidic chemical nickel electroplating plating solution for the electron and the acidic chemical nickel electroplating plating solution for the circuit board. The chemical nickel-plating stabilizer has excellent stabilizing effect and is environmental friendly, and the three chemical nickel plating solution has low toxicity and wide application range and is safe and environmental friendly.

Description

technical field [0001] The patent of the invention relates to the field of electroless plating solution, in particular to an electroless nickel plating stabilizer, an alkaline electroless nickel plating solution for plastic electroplating, an acidic electroless nickel plating solution for electronic electroplating and an acidic electroless nickel plating solution for circuit boards. Background technique [0002] The most difficult problem of electroless nickel plating is the instability of the plating solution. The electroless nickel plating solution is a thermodynamically unstable system. During the normal operation of electroless nickel plating, there will generally be a small amount of nickel or nickel-phosphorus spontaneously formed in the entire plating solution, or precipitated on the tank wall, or suspended in the plating solution. This forms the catalytic core, leading to the natural decomposition of the bath. At the same time, there may be dust, sand, etc. in the p...

Claims

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Application Information

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IPC IPC(8): C23C18/36
Inventor 刘迪
Owner 深圳市华傲创表面技术有限公司