Manufacturing method of subminiature MEMS gyroscope sensor

Abstract

The invention discloses a manufacturing method of a subminiature MEMS gyroscope sensor, which comprises the following steps: providing MEMS wafer, depositing silicon dioxide through a CVD process, and then depositing silicon nitride through the CVD process; etching the patterns of silicon dioxide and silicon nitride on the front surface of the wafer, etching the wafer through using a RIE process, and forming a spring area and a metal landfill area in an MEMS structure; sputtering a metal layer on the front surface of the wafer to be as a seed layer, exposing the landfill area after photoetching, filling metal the density of which is more than that of silicon at the metal landfill area; removing photosensitive resist on the front surface of the MEMS wafer, removing the seed layer of the rest positions of the surface of the wafer; preparing sheet glass two sides of which are polished, corroding a groove on the glass by using a dry method to form a gap between a mass block and a glass cavity on the wafer; and sputtering metal on the back of the wafer, forming electrode after photoetching, and finally removing the photosensitive resist. The invention reduces the dimension of the mass block or increases the mass of the mass block.

Description

Technical field [0001] The present invention relates to a micro-electro-mechanical system (Micro-Electro-Mechanical System, MEMS for short) processing technology, and in particular to a manufacturing method of an ultra-small MEMS gyroscope sensor. Background technique [0002] Microelectromechanical systems (MEMS) are technologies for designing, processing, manufacturing, measuring, and controlling micro / nano materials. It can integrate mechanical components, optical systems, drive components, and electronic control systems into a microsystem as an integral unit. It uses a manufacturing process that combines microelectronics technology and micromachining technology to produce a variety of sensors, actuators, drives and microsystems with excellent performance, low price, and miniaturization. Micromachining technology includes silicon body micromachining, silicon Technologies such as surface micromachining, LIGA (LIGA is the German word Lithographie, Galanoformung and Abformun...

AI Technical Summary

Problems solved by technology

Therefore, in order to reduce the size of the device as much as possible to reduce the cost, or to improve the performance of the device under the same size of the mass block, people have tried various methods, but there is no breakthrough technology

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