Method for preparing thermosetting phenolic resin film

A phenolic resin and thermosetting technology, which is applied in the field of preparation of thermosetting phenolic resin films to achieve important economic and social benefits and rich variety of effects

Inactive Publication Date: 2010-09-29
NORTHWESTERN POLYTECHNICAL UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, only a few resins such as epoxy resin and cyanate resin are suitable for the resin film matrix of the hot-melt method to prepare the prepreg pr

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] Raw materials: phenol 23.5g

[0030] Bisphenol A 114.0g

[0031] Paraformaldehyde 27.0g

[0032] Ammonia solution (28wt%) 5.5g

[0033] Polyvinyl alcohol 5.0g

[0034] Process: After adding phenol and bisphenol A to the reaction vessel, sequentially add ammonia solution (28wt%), paraformaldehyde, and polyvinyl alcohol, stir evenly, control the temperature at 90-100°C, and react for 0.5-1.5 hours. Remove free small molecular substances at 60~90℃, -0.06~-0.09MPa. The reactant was poured on release paper, cooled naturally, and the product was light yellow transparent solid.

[0035] Properties: room temperature state: semi-solid, can be bent at will

[0036] Film forming and detachability: good

[0037] Softening point: 41~54℃

[0038] Viscosity: 1050~2000mPa·s(90~120℃)

[0039] Gel time: 60~120min (90~120℃)

Embodiment 2

[0041] Raw materials: catechol 110.1g

[0042] 37wt% formaldehyde solution 194.6g

[0043] Magnesium oxide 6.5g

[0044] Polyvinyl butyral 8.8g

[0045] Process: After adding catechol into the reaction vessel, add magnesium oxide, 37wt% formaldehyde solution, and polyvinyl butyral in sequence. After stirring evenly, control the temperature at 70-85°C and react for 7-10 hours. ~90°C, -0.06~-0.09MPa to remove free small molecular substances. The resulting resin was prepared into a resin film on a hot-melt prepreg machine. The obtained resin film has a width of 300mm and a density of 400g / m 2 .

[0046] Performance: Good film-forming property, capable of bending and winding, which can meet the technological requirements of continuous industrial production.

[0047] Film forming and detachability: good

[0048] Softening point: 38~54℃

[0049] Viscosity: 700~1200mPa·s(90~120℃)

[0050] Gel time: 50~130min (90~120℃)

Embodiment 3

[0052] Raw material: phenol 65.8g

[0053] α-Naphthol 43.3g

[0054] Paraformaldehyde 96.1g

[0055] Barium hydroxide 7.5g

[0056] Polysulfone 2.5g

[0057] Polyvinyl alcohol 4.0g

[0058]Process: After adding α-naphthol and phenol into the reaction vessel, add barium hydroxide, paraformaldehyde, polysulfone and polyvinyl alcohol in sequence, after stirring evenly, control the temperature at 70-85°C, and after the reaction time is 7-10 hours, Remove free small molecular substances at 60~90℃, -0.06~-0.09MPa. The resulting resin was prepared into a resin film on a hot-melt prepreg machine. The obtained resin film has a width of 300mm and a density of 400g / m 2 .

[0059] Performance: Good film-forming property, capable of bending and winding, which can meet the technological requirements of continuous industrial production.

[0060] Film forming and detachability: good

[0061] Softening point: 30~50℃

[0062] Viscosity: 500~1200mPa·s(90~1...

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Abstract

The invention relates to a method for preparing a thermosetting phenolic resin film, which is characterized by comprising the following steps of: adding phenol into a reaction container, and adding a basic catalyst; adding aldehyde and a thermoplastic film-forming agent to perform a reaction at the temperature of between 55 and 120 DEG C for 0.5 to 10 hours; performing a reaction at the temperature of between 60 and 90 DEG C and under the pressure of between 0.06 below zero and 0.09 MPa below zero until the viscosity is between 500 and 3,000 mPa.s to obtain synthetic substances from which dissociative small-molecule substances are removed; and finally making the synthetic substances into the phenolic resin film. The method meets the process requirements of the preparation of preimpregnation materials by a hot melting method, develops phenolic resin with the excellent film-forming property at room temperature, enriches varieties of resin matrixes for a process of preparing the preimpregnation materials by the hot melting method, so that the resin matrixes can be used in engineering as soon as possible to create great economic and social benefits.

Description

technical field [0001] The invention relates to a method for preparing a thermosetting phenolic resin film, in particular to a method for preparing a thermosetting phenolic resin film used in an RFI molding process and a hot-melt method for preparing a prepreg. Background technique [0002] Resin Film Infusion (RFI) process has outstanding advantages such as low mold cost, low molding pressure, high impregnation efficiency, low organic volatilization, small void ratio of products, and high fiber content. In recent years, it has been used in aviation, aerospace, navigation, Automotive and other fields have been increasingly widely used. The characteristics of the RFI process require that the resin matrix has good film-forming properties at room temperature, can maintain a low viscosity for a period of time at the infiltration temperature, and can well infiltrate the fiber preform. At present, there are only a few resins such as epoxy resin, unsaturated resin and bismaleimide...

Claims

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Application Information

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IPC IPC(8): C08L61/12C08L61/08C08L29/04C08L29/14C08L81/06C08L71/12C08G8/24C08G8/20C08G8/10C08G8/04B29C41/24B29L7/00
Inventor 梁滨陈立新董建娜赵慧欣梁凤飞
Owner NORTHWESTERN POLYTECHNICAL UNIV
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