Method for manufacturing golden finger of soldering-pan of flexible package carrying board

A technology for encapsulating substrates and manufacturing methods, applied in semiconductor/solid-state device manufacturing, electrical connection formation of printed components, electrical components, etc., to achieve the effects of ensuring stress, reducing stress, and improving coating

Inactive Publication Date: 2010-10-06
SHENZHEN DANBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to overcome the deficiencies in the prior art and provide a COF packaging flexible carrier pad gold finger manufacturing method to solve the problem of cracks that do not occur when the gold finger is bent during the assembly process

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] Nickel sulfate: 25 g / L;

[0030] Sodium hypophosphite: 30 g / L;

[0031] Glycine: 5 g / L

[0032] Lactic acid: 20 g / l

[0033] Pb 2+ : 1mg / L

[0034] Sodium naphthalene disulfonate: 2 g / L

[0035] Temperature: 80°C

[0036] pH: 4.90

Embodiment 2

[0038] Nickel sulfate: 25 g / L;

[0039] Sodium hypophosphite: 30 g / L;

[0040] Glycine: 10 g / L

[0041] Succinic acid: 10 g / L

[0042] Pb 2+ : 1mg / L

[0043] Sodium naphthalene disulfonate: 2 g / L

[0044] Temperature: 80°C

[0045] pH: 4.90

Embodiment 3

[0047] Nickel sulfate: 25 g / L;

[0048] Sodium hypophosphite: 30 g / L;

[0049] Glycine: 5 g / L

[0050] Lactic acid: 20 g / l

[0051] Pb 2+ : 1mg / L

[0052] Sodium naphthalene disulfonate: 2 g / L

[0053] Sodium saccharin: 2 g / L

[0054]Temperature: 80°C

[0055] pH: 4.90

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PUM

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Abstract

The invention relates to a method for manufacturing a flexible carrying board of which the chip is directly packaged on a flexible printed circuit carrying board (COF), in particular to a method for manufacturing a golden finger of a soldering-pan of a flexible carrying board. The COF packaged flexible carrying board is made of a glueless flexible substrate; a basement membrane of the substrate is made of a polyimide material and has the thickness between 12 and 25 micrometers; and a conductor layer is made of copper, and has the thickness between 9 and 36 micrometers. The method for manufacturing the golden finger of the soldering-pan of the flexible carrying board comprises low-stress electroless nickel plating & gold immersion technology; a raw material is nickel sulfate and a reducing agent is sodium hypophosphite; and in order to reduce the stress of a nickel layer, an additive for reducing the stress is added. The low-stress additive is one or more of benzene sulfonic acid sodium salt, coumarin, formaldehyde, aldehyde and naphthalene disulfonic acid, and the concentration is 0.01 to 0.2 mol / liter. The operating temperature of the low-stress electroless nickel plating is between 80 and 85 DEG C and the pH value is between 4.8 and 5.2.

Description

Technical field: [0001] The invention belongs to the field of printed circuit packaging, and relates to a method for manufacturing a flexible packaging carrier in which a chip is directly packaged on a flexible printed circuit carrier (COF), in particular to the manufacture of a connecting finger of a flexible carrier board method. technical background: [0002] COF is the abbreviation of "Chip On Flex" in English, that is, the chip is directly mounted on a flexible printed circuit board (hereinafter also referred to as a flexible printed circuit carrier, a flexible packaging carrier, a flexible carrier or a flexible board). This connection method has a high degree of integration, and peripheral components can be mounted on a flexible printed circuit board together with the IC, which is an emerging technology. Due to the continuous development of electronic products towards the trend of light, thin and small, flexible boards, in addition to the original function of signal t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/48H05K3/40
Inventor 刘萍陈兵
Owner SHENZHEN DANBOND TECH
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