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Positive photo-sensitive resin composition and solidification film forming method using the same

A technology of photosensitive resin and composition, applied in the field of cured film formation and positive photosensitive resin composition, can solve the problems of insufficient adhesion and transmittance, low transmittance, low sensitivity and transmittance, etc. Excellent storage stability and excellent transmittance

Inactive Publication Date: 2010-11-03
FUJIFILM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, its adhesion and transmittance are not sufficient, so it cannot meet the requirements for the manufacture of high-quality liquid crystal display elements
Patent Document 4 proposes a radiation-sensitive resin composition, which is characterized in that it contains a resin (the resin contains an acetal structure and / or a ketal structure and an epoxy group) and an acid generator, but its sensitivity and transmittance are low , unsatisfactory
Patent Document 5 proposes a radiation-sensitive resin composition, which is characterized in that it contains a hydroxystyrene resin protected with acetal or ketal, a compound that generates an acid when irradiated with active light with a wavelength of 300 nm or more, and a cross-linked resin. agent, but its transmittance is low and unsatisfactory

Method used

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  • Positive photo-sensitive resin composition and solidification film forming method using the same
  • Positive photo-sensitive resin composition and solidification film forming method using the same
  • Positive photo-sensitive resin composition and solidification film forming method using the same

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preparation example Construction

[0266] The preparation method of the composition solution: according to the prescribed ratio, the (A) component, (B) component, (C) component and other ingredients are mixed and stirred to dissolve by any method to prepare the composition solution. For example, a composition solution may be prepared by dissolving various components in a solvent in advance to prepare a solution, and then mixing these solutions at a predetermined ratio. The composition solution thus prepared can also be used after being filtered through a filter having a pore diameter of 0.2 μm or the like.

[0267]

[0268]A desired coating film can be formed by applying a composition solution on a predetermined substrate and removing the solvent by heating (hereinafter referred to as "prebaking"). Examples of the above-mentioned substrate include a glass plate provided with a polarizing plate, a black matrix layer and a color filter layer provided as necessary, and a transparent conductive circuit layer in t...

Embodiment

[0280] The present invention will be described in more detail below by way of examples. However, the present invention is not limited to these Examples.

Synthetic example 1

[0281] (Synthesis Example 1: Synthesis of A1-1)

[0282] Put 89.4g (0.36 mole) p-(1-n-butoxyethoxycarbonyl) styrene, 21.1g (0.12 mole) benzyl methacrylate, 17.8g (0.12 mole) p-ethylene into a 500mL three-necked flask benzoic acid and 300mL methyl isobutyl ketone, to which a catalytic amount of 2,2'-azobis(2-methyl propionate) was added as a free radical polymerization initiator, under nitrogen flow at 80°C Polymerization was 6 hours. After cooling the reaction liquid, a large amount of heptane was injected to precipitate a polymer. After the crystals were collected by filtration, they were dissolved in diethylene glycol ethyl methyl ether, and the heptane and methyl isobutyl ketone contained in the solution were distilled off under reduced pressure to obtain polymer A1-1 (p-( 1-n-butoxyethoxycarbonyl)styrene / benzyl methacrylate / p-vinylbenzoic acid) in diethylene glycol ethyl methyl ether.

[0283] The molecular weight and molecular weight distribution of the obtained polyme...

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Abstract

The invention provides a positive photo-sensitive resin composition and a solidification film forming method using the same with excellent sensitivity, residue film rate and storage stability, capable of forming the solidification film with excellent heat tolerance, adhesive ability and transmissivity by solidifying the composition, characterized in that: the positive photo-sensitive resin composition comprises a special styrene structure unit capable of generating the carboxylic group by dissociating the dissociation group and a resin being alkali insoluble or alkali poorly-insoluble and capable of changing into be alkali soluble after dissociating the dissociation group; a resin of a structure unit derived by a free radical polymerization monomer containing an epoxy group; a compound with more than two epoxy groups (not containing the resin of the structure unit formed by the free radical polymerization monomer containing the epoxy group) and a compound for generating the acid by irradiating the active ray with wavelength of more than 300nm.

Description

technical field [0001] The present invention relates to a positive photosensitive resin composition and a cured film forming method using the composition. More specifically, the present invention relates to a positive-type photosensitive resin composition suitable for forming a flat film, a protective film, or an interlayer insulating film of electronic components such as liquid crystal display elements, integrated circuit elements, solid-state imaging elements, and organic ELs; A method for forming a cured film of the composition. Background technique [0002] Conventionally, in electronic components such as liquid crystal display elements, integrated circuit elements, solid-state imaging elements, and organic EL, when forming a flat film for imparting flatness to the surface of the electronic component, a protective film for preventing deterioration or damage of the electronic component, or When used for an insulating interlayer insulating film, a photosensitive resin com...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/004G03F7/00
CPCG03F7/027G03F7/0397H01L21/0274Y10S430/1055
Inventor 泷田敏安藤豪
Owner FUJIFILM CORP
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