Multifunctional ion beam sputtering deposition and etching equipment

Abstract

The invention discloses multifunctional ion beam sputtering deposition and etching equipment which comprises a vacuum chamber, a sputtering deposition and etching workbench, an etching ion source, two sputtering target platforms, two sputtering ion sources and an assistant cleaning ion source, wherein the sputtering deposition and etching workbench is arranged in the top middle position of the vacuum chamber, and the lower surface thereof is parallel to the horizontal plane; the etching ion source is arranged in the bottom middle position of the vacuum chamber and opposite to the sputtering deposition and etching workbench; the two sputtering target platforms are arranged at the lower part of the vacuum chamber and symmetrical bilaterally to the direction of an ion beam emitted by the etching ion source; the two sputtering ion sources are arranged in the middle of the vacuum chamber and symmetrical bilaterally to the direction of the ion beam emitted by the etching ion source; the emitted ion beam and a target surface loaded on the sputtering target platforms form an angle of 45 DEG; the assistant cleaning ion source is arranged in the middle of the vacuum chamber; and the emitted ion beam and the lower surface of the sputtering deposition and etching workbench form an angle of 30 DEG. The equipment has various functions and can be used for sputtering deposition, etching, polishing thinning and heat treatment of media and metal materials.

Description

technical field [0001] The invention relates to the technical field of thin film deposition equipment, in particular to a multifunctional ion beam sputtering deposition and etching equipment. Background technique [0002] Ion beam sputtering deposition (IBSD) is one of the important methods of thin film preparation in semiconductor technology. According to the principle of sputtering, the surface of the target is bombarded with a low-energy focused ion beam, and the sputtered target is deposited on the surface of the substrate and deposited on the surface of the substrate. firmly attached to the substrate surface. The filament in the ion gun generates thermal electrons under high pressure, which ionize argon gas into Ar + , are accelerated under an electric field to form an ion beam. [0003] Reactive ion beam sputtering deposition (RIBD) can be performed under local oxygen pressure or oxygen ion beam bombardment to prepare oxide films. [0004] In the process of film dep...

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Problems solved by technology

[0008] Because ion beam has various functions such as ion beam sputtering deposition, ion beam assisted sputtering, ion beam etching, ion beam cleaning, ion beam polishing, ion beam thinning, etc., many vacuum equipment manufacturers in the world are using ion beam Development and production of sputtering deposition and etching equipment, but most of the developed and produced equipment has single functions, such as no co-sputtering function, heating function, and simultaneous sputtering and etching, etc.

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