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High-performance copper-diamond electrical contact material and preparation process thereof

A technology of electrical contact material and manufacturing process, applied in the directions of contacts, circuits, electrical switches, etc., can solve the problems of component segregation, poor fixing ability, and reduced wear resistance and welding resistance of electrical contact materials. To achieve the effect of enhancing bonding, ensuring anti-wear performance, and improving anti-fusion welding performance

Active Publication Date: 2010-11-17
WENZHOU LONGSUN ELECTRICAL ALLOY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, this technical solution has the following problems: First, component segregation is prone to occur, that is, in the sintered copper alloy, the added elements such as rare earth, chromium, zirconium or niobium may still exist in a simple state
The bonding ability between these two different substances is poor; the wear resistance and welding resistance of the electrical contact material will be greatly reduced after long-term use

Method used

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  • High-performance copper-diamond electrical contact material and preparation process thereof
  • High-performance copper-diamond electrical contact material and preparation process thereof
  • High-performance copper-diamond electrical contact material and preparation process thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] The composition formula of the high-performance copper-diamond contact material of the present invention is 0.05% of diamond powder (excluding the weight of coated copper) and 99.95% of copper alloy powder by weight percentage.

[0041] The formula of the copper alloy powder is 0.01(mas)% of silver, 0.02(mas)% of nickel, 0.02(mas)% of zirconium and 99.95(mas)% of copper.

[0042] The manufacturing process of the electrical contact material as shown in Figure 1:

[0043] 1) Preparation of copper alloy powder by high-pressure water atomization method: according to the above-mentioned formula of copper alloy powder, silver, nickel, zirconium and copper metal raw materials are weighed and melted in an intermediate frequency furnace; the melting process is protected by nitrogen, and the temperature is controlled at 1100~1200℃. Then, the copper alloy melt flows through the high-pressure water mist nozzle and is atomized into powder with uniform particle size, the particle si...

Embodiment 2

[0055] The manufacturing process is the same as in Example 1. The composition formula of the high-performance copper-diamond contact material of the present invention is 0.5% of diamond powder (excluding the weight of coated copper) and 99.5% of copper alloy powder by weight percentage.

[0056] The formula of the copper alloy powder is 0.1(mas)% of silver, 0.1(mas)% of nickel, 0.1(mas)% of zirconium and 99.7% of copper.

Embodiment 3

[0058] The manufacturing process is the same as in Example 1. The composition formula of the high-performance copper-diamond contact material of the present invention is 2% of diamond powder (excluding the weight of coated copper) and 98% of copper alloy powder by weight percentage.

[0059] The formula of the copper alloy powder is 1.0(mas)% of silver, 1.0(mas)% of nickel, 1.0(mas)% of zirconium and 97% of copper.

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Abstract

The invention relates to a preparation process of powder metallurgy material, in particular to high-performance copper-diamond electrical contact material and a preparation process thereof. The high-performance copper-diamond electrical contact material comprises the following raw materials by weight percentage: 0.001%-5.0% of diamond powder and 95%-99.999% of copper alloy powder, wherein the grain size of the diamond powder is 0.1-15 mum, and the surface of the diamond powder is coated with copper. The preparation process of the high-performance copper-diamond electrical contact material comprises the following steps: (1) preparing the raw materials: preparing the copper alloy powder by using a high-pressure spray method, preparing the copper-coated diamond powder by using a liquid-phase reduction method and mixing the copper alloy powder and the copper-coated diamond powder; (2) preparing the electrical contact material: firstly, carrying out thermal diffusion treatment to the mixture of the copper alloy powder and the copper-coated diamond powder, sintering the compressed and moulded mixture in vacuum, and thermally extruding and moulding the mixture; and (3) preparing electrical contact sectional material: rolling or drawing and machining the copper-diamond electric contact into the required-size sectional material.

Description

technical field [0001] The invention relates to a powder metallurgy material and a manufacturing process thereof, in particular to a high-performance copper-diamond electric contact material and a manufacturing process thereof. Background technique [0002] Electric contacts are contact elements of electrical switches, instruments, etc.; they are mainly responsible for connecting and disconnecting circuits and load currents; their performance directly affects the reliability and service life of electrical switches and instruments. At present, silver-based electrical contact materials are the main materials; however, silver-based electrical contacts are expensive and the production cost is high. For this reason, people choose copper with strong electrical and thermal conductivity and low price to replace silver as the material of electrical contacts. [0003] Chinese patent (CN1787137A) discloses a copper-diamond electrical contact material with a trace amount of silver adde...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F1/00B22F1/02B22F3/16H01H1/025H01H1/027
Inventor 郑元龙郑大受郑旭阳郑献浩
Owner WENZHOU LONGSUN ELECTRICAL ALLOY CO LTD
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