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Copper powder for electrically conductive paste, and electrically conductive paste

A conductive paste technology, applied in the field of conductive paste, can solve the problem of poor oxidation resistance, and achieve the effect of excellent oxidation resistance and fine copper powder particle size

Inactive Publication Date: 2010-11-24
MITSUI MINING & SMELTING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, copper powder is suitable as a conductive material for conductive paste due to its high conductivity, but as the particle size becomes finer, the oxidation resistance deteriorates. In order to improve this situation, silver powder with oxidation resistance is used. Coating the particle surface (Patent Document 1), coating with an inorganic oxide (Patent Document 2) and other countermeasures

Method used

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  • Copper powder for electrically conductive paste, and electrically conductive paste
  • Copper powder for electrically conductive paste, and electrically conductive paste
  • Copper powder for electrically conductive paste, and electrically conductive paste

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0058] After filling the chamber and raw material melting chamber of the gas atomization device (manufactured by Nisshin Giken Co., Ltd., NEVA-GP2 type) with nitrogen, the raw material is heated and melted in the carbon crucible in the melting chamber to form a melt (after melting 1.77 g of metal silicon (NIKSIL manufactured by Nippon Metal Chemical Industry Co., Ltd.) was added to the metal solution of electrolytic copper to prepare 800 g of the metal solution, which was fully stirred and mixed). Thereafter, the metal solution was sprayed at 1250° C. and 3.0 MPa from a nozzle with a diameter of φ1.5 mm to obtain a copper powder containing silicon in the particle. Then, sieve was performed with a 53 μm test sieve, and the copper powder that passed through the sieve holes was used as the final copper powder. Table 2 shows the characteristics of the obtained copper powder.

Embodiment 2～4

[0060] Except having changed the metal silicon addition amount as shown in Table 1, it carried out similarly to Example 1, and obtained copper powder.

Embodiment 5～11

[0062] Copper powder was obtained in the same manner as in Example 1, except that a copper-phosphorus master alloy (phosphorus grade: 15% by mass) was added as shown in Table 1 in addition to metal silicon.

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Abstract

Disclosed is a copper powder which has a good balance between oxidation resistance and electrical conductivity in spite of having a small grain size. Also disclosed is a copper powder for use in an electrically conductive paste, which is reduced in the variations in shape or grain size and has a low oxygen content. Further disclosed is an electrically conductive paste. In the copper powder for an electrically conductive paste, Si (silicon) is contained in the inside of each particle at a content of 0.1 to 10 atm%.

Description

technical field [0001] The present invention relates to a copper powder used in a conductive paste and a conductive paste using the copper powder, and particularly relates to a conductive circuit formation suitable for a screen printing additive method or an external electrode for a laminated ceramic capacitor, etc. Copper powders such as conductive materials used in conductive pastes for various electrical contact parts and conductive pastes using the copper powders. Background technique [0002] Because of its ease of use, copper powder is used as a conductive material for conductive circuit formation by screen printing additive method, or as a conductive paste for various electrical contact parts such as external electrodes of laminated ceramic capacitors, etc. , has been widely used. [0003] The above-mentioned conductive paste can be obtained, for example, by mixing and kneading various additives such as resin such as epoxy resin and its curing agent with copper powde...

Claims

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Application Information

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IPC IPC(8): C22C9/10B22F1/00B22F9/08H01B1/00H01B1/22B22F1/10
CPCC22C9/00B22F1/0059C22C9/10H01B1/22C22C1/0425H01G4/008B22F1/10
Inventor 织田晃祐栗本透上住义明三宅行一吉丸克彦
Owner MITSUI MINING & SMELTING CO LTD
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