Method for producing phase type photon sieve based on HSQ (Hexadecimal Sequential) process

A photon sieve and phase-type technology, which is applied in the direction of exposure devices, optics, and optical components in photolithography, can solve problems such as difficulty in ensuring flatness, high cost of use, and impact on product quality, so as to improve the limit resolution and reduce the production cost. cost, effect of high resolution

Inactive Publication Date: 2010-12-22
INST OF MICROELECTRONICS CHINESE ACAD OF SCI
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Problems solved by technology

[0005] However, the phase-type photonic sieve is usually produced by etching, which has the disadvantages of high cost and low efficiency.
Especially for phase-type photon sieves with protrusions, the commonly used plasma etching equipment will etch away most of th

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  • Method for producing phase type photon sieve based on HSQ (Hexadecimal Sequential) process
  • Method for producing phase type photon sieve based on HSQ (Hexadecimal Sequential) process
  • Method for producing phase type photon sieve based on HSQ (Hexadecimal Sequential) process

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Embodiment Construction

[0047] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be described in further detail below in conjunction with specific embodiments and with reference to the accompanying drawings.

[0048] Such as image 3 As shown, the phase-type photonic sieve used in the present invention consists of a quartz substrate, a metal chromium film plated on the quartz substrate, and planar light-transmitting holes and raised light-transmitting holes randomly distributed on the metal chromium film. Wherein: the diameter of the quartz substrate is 4 inches, and the thickness is 3mm; the thickness of the metal chromium film plated on the quartz substrate is about 60nm. The design parameters are: photon sieve diameter 100mm, design wavelength 355nm, focal length 0.939m, outermost ring hole diameter 5μm, ring number 3000 rings, characteristic size 3.33μm.

[0049] The randomly distributed light-transmitting small holes are ...

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Abstract

The invention discloses a method for producing a phase type photon sieve based on an HSQ (Hexadecimal Sequential) process, comprising the following steps of: A. manufacturing a first photon sieve photomask A and a second photon sieve photomask B; B. coating HSQ glue on a substrate, phtoetching and drying the HSQ glue by using the first photon sieve photomask and evaporating a layer of metal film; C. removing the metal membrane on the HSQ by using an electrochemical corrosion method; D. coating 5241 positive photoresist on the substrate, photoetching the substrate by using the second photon sieve photomask B and removing the metal member of the exposed part; and E. obtaining the phase type photon sieve after the photoresist is removed. Compared with the traditional etching method, the invention has the characteristics of simple manufacturing process, low cost, favorable stability, capability of reaching higher resolution and the like and is beneficial to being widely popularized and applied.

Description

technical field [0001] The invention relates to the technical field of diffractive optical elements, in particular to a method for manufacturing a phase-type photon sieve by using an HSQ process. Background technique [0002] Photon sieve is a new type of diffractive optical element based on Fresnel zone plate. It replaces the area corresponding to the bright ring on the Fresnel zone plate with a large number of randomly distributed light-transmitting small holes, and the diameter of the small hole is 1.53 times the width of the ring of the corresponding zone plate. The randomly distributed light-transmitting holes make the diffracted light interfere with each other, which can effectively suppress the side lobe effect and advanced diffraction, improve the resolution, and obtain a sharper focal spot. [0003] The resolution of the traditional zone plate in the field of imaging is determined by the width of its outermost ring, which is limited by the processing technology, so...

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Application Information

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IPC IPC(8): G02B5/00G03F7/20
Inventor 贾佳潘一鸣谢常青朱效立刘明
Owner INST OF MICROELECTRONICS CHINESE ACAD OF SCI
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