Crystalline silicon solar battery and preparation method thereof
A technology of solar cells and crystalline silicon, applied in the field of solar cells, can solve problems such as increasing recombination loss and reducing cell conversion efficiency
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Embodiment 1
[0078] According to the manufacturing method of the present invention, the battery of one of the present inventions is manufactured, but before step 5, the silicon oxide film on the crystalline silicon wafer is removed. Use the same silicon material as the usual industrial production of crystalline silicon solar cells, that is, oriented p-type monocrystalline silicon wafers with a thickness of 0.2mm at the CZ level. The selected process parameters are: resistivity of p-type monocrystalline silicon wafers About 1Ωcm; p on the back + type heavily doped layer, its sheet resistance is about 3Ω / □; the front n + Type heavily doped layer, its thickness is about 40nm, and its doping concentration is about 9×10 19 / cm 3 ; The window layer is an ITO thin film made by evaporation, and the material used is 99.9999% high-purity InSn alloy (ratio: 9:1). When evaporating, the temperature of the crystal silicon wafer is heated to 300 ° C, and its square resistance is ≤ 20Ω / □, its thickne...
Embodiment 2
[0080] According to the manufacturing method of the present invention, the battery of one of the present inventions is manufactured, but before step 5, the silicon oxide film on the crystalline silicon wafer is removed. The crystal orientation n-type single crystal silicon wafer with a thickness of 0.2mm of CZ level is used, and the process parameters are selected as follows: the resistivity of the n-type single crystal silicon wafer is about 1Ωcm; + type heavily doped layer, its sheet resistance is about 1Ω / □; the front p + Type heavily doped layer, its thickness is about 40nm, and its doping concentration is about 9×10 19 / cm 3 ; The window layer is an ITO thin film made by evaporation, and the material used is 99.9999% high-purity InSn alloy (ratio: 9:1). When evaporating, the temperature of the crystal silicon wafer is heated to 300 ° C, and its square resistance is ≤ 20Ω / □, its thickness is about 150nm; the distance between the metal grid lines of the front grid-shape...
Embodiment 3
[0082] The second battery of the present invention is manufactured according to the manufacturing method of the present invention. Use the same silicon material as the usual industrial production of crystalline silicon solar cells, that is, oriented p-type monocrystalline silicon wafers with a thickness of 0.2mm at the CZ level. The selected process parameters are: resistivity of p-type monocrystalline silicon wafers About 1Ωcm; p on the back + type heavily doped layer, its sheet resistance is about 3Ω / □; the front n + Type heavily doped layer, its thickness is about 10-20nm, and its doping concentration is about 5×10 19 / cm 3 , the thickness of the impurity defect barrier layer (silicon oxide film) is about 7-15nm; the window layer is an ITO film made by sputtering, the material used is a common ITO target, and the temperature of the crystalline silicon wafer during sputtering is less than 150℃, its square resistance is about 40Ω / □, and its thickness is about 150nm; the d...
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Abstract
Description
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