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Halogen-free low temperature solidified silver paste and preparation method thereof

A silver paste, low temperature technology, used in cable/conductor manufacturing, conductive materials dispersed in non-conductive inorganic materials, electrical components, etc. Excellent performance and drying performance

Inactive Publication Date: 2011-01-19
IRICO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, the price of silver continues to rise, leading to an increase in the cost of silver paste

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0065] Preparation of conductive powder: choose flake silver powder with a particle diameter of 3-10 μm and silver-coated nickel powder with a diameter of 5-15 μm to mix, and the mass ratio is 90:10.

[0066] The solvent is propylene glycol methyl ether acetate and ethyl cellosolve acetate, the mass ratio of which is 1:4.

[0067] The polymer resin is Dynapol L205.

[0068] The coupling agent is selected from organosilane coupling agent A-174.

[0069] The dispersant is BYK-310.

[0070] The mass percentages of each component are:

[0071] Conductive Powder: 40%,

[0072] Solvent: 46%,

[0073] Polymer resin: 12%,

[0074] Coupling agent 1%,

[0075] Dispersant 1%;

[0076] First, the solvent and polymer resin are mixed at a high speed at 70°C to a uniform state to form an organic vehicle; then the pre-mixed conductive powder is added to the organic vehicle, and organic silane coupling agent A-174 and surface dispersant are added. Gram BYK-310, after stirring with a mi...

Embodiment 2

[0078] Preparation of conductive powder: choose flake silver powder with a particle diameter of 5-10 μm and silver-coated nickel powder with a diameter of 10-15 μm to mix, and the mass ratio is 95:5.

[0079] The solvents are selected from DBE, ethyl carbitol acetate and propylene glycol methyl ether acetate.

[0080] The polymer resin is selected as SK ES-300 type polyester resin and Toyobo 500 type polyester resin.

[0081] The dispersant is BYK-310.

[0082] The thickener is fumed silica LM150.

[0083] The mass percentages of each component are:

[0084] Conductive Powder: 50%,

[0085] DBE: 18%,

[0086] Ethyl Carbitol Acetate: 15%,

[0087] Propylene glycol methyl ether acetate: 4%,

[0088] ES-300: 6%,

[0089] Toyobo 500: 6%,

[0090] Dispersant 0.5%,

[0091] Thickener 0.5%;

[0092] First, mix SK ES-300 polyester resin and DBE at 60°C to a uniform state at high speed to form an organic vehicle 1; mix Toyobo 500 polyester resin with ethyl carbitol acetate an...

Embodiment 3

[0094] Preparation of conductive powder: choose flake silver powder with a particle diameter of 3-10 μm and silver-coated nickel powder with a diameter of 3.5-4.0 μm to mix, and the mass ratio is 92:8.

[0095] The solvent is ethyl cellosolve acetate and propylene glycol methyl ether acetate.

[0096] Polymer resin is selected R-60B type polyester resin and R-40B type polyester resin.

[0097] The coupling agent is selected from organosilane coupling agent A-174.

[0098] The dispersant is BYK-310.

[0099] The mass percentages of each component are:

[0100] Conductive powder: 42.5%,

[0101] Ethyl cellosolve acetate: 35%,

[0102] Propylene glycol methyl ether acetate: 5%,

[0103] R-60B: 9%,

[0104] R-40B: 6%,

[0105] Coupling agent 1.5%,

[0106] Dispersant 1%;

[0107] First, mix R-60B and R-40B polyester resins, ethyl cellosolve acetate, and propylene glycol methyl ether acetate at a high speed at 65°C to a uniform state to form an organic vehicle, then add co...

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Abstract

The invention provides a halogen-free low temperature solidified silver paste, which comprises the following raw materials in percentage by mass: 40 to 50 percent of conductive powder, 37 to 46 percent of solvents, 8 to 20 percent of high polymer resin and 1 to 3 percent of additives, wherein the conductive powder is a mixture of flake silver powder and silver coated nickel powder; the solvent is one or more of DBE, diethylene glycol monoethyl ether acetate, propylene glycol methyl ether acetate and ethylene glycol monoethyl ether acetate; the high polymer resin is one or more of polyester resins and polyurethane resins; and the additives comprise one or more of coupling agents, thickening agents and leveling agents. In the halogen-free low temperature solidified silver paste of the invention, the conductive powder is successfully used for replacing silver powder, which not only can reduce the cost, but also satisfies European safety standards, and reduces environment pollution.

Description

technical field [0001] The invention relates to a conductive paste, in particular to a halogen-free low-temperature curing silver paste and a preparation method thereof. Background technique [0002] Since 2009, EU countries have implemented halogen restriction laws to limit the content of halogens in electronic products entering EU countries. The electronic paste is mainly used in keyboard circuits and membrane switches of electronic products, so the halogen-free organic part of the conductive paste is also imperative. [0003] Generally, the organic carrier part of conductive silver paste used in membrane switches and keyboard circuits mainly contains halogen. This organic system has short drying times, strong adhesion, low dry film resistance and good flex resistance. However, the drying time of general halogen-free conductive silver paste is much higher than that of halogen-containing silver paste, and the conductive effect and other properties are not ideal. With the...

Claims

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Application Information

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IPC IPC(8): H01B1/22H01B13/00
Inventor 朱万超
Owner IRICO
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