Scale-inhibiting copper-based heat exchange surface and manufacturing method thereof
A technology of heat exchange surface and manufacturing method, which is applied in the direction of liquid chemical plating, metal material coating process, coating, etc., can solve the problems of poor timeliness, affecting heat exchange effect, increasing heat conduction resistance of pipe wall, etc., and achieves Reduce surface energy, ensure heat transfer effect, and improve thermal conductivity
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Embodiment 1
[0054]The plating solution of described electroless Ni-P-PTFE composite coating comprises following components:
[0055] Nickel sulfate 20~30g / L;
[0056] Sodium hypophosphite 25~35g / L;
[0057] Sodium citrate 6~10g / L;
[0058] Lactic acid 10~20ml / L;
[0059] Sodium acetate 10~20g / L;
[0060] Cationic surfactant 0.4~0.6g / L;
[0061] Concentration is 60wt% PTFE 10~14ml / L.
Embodiment 2
[0063] The plating solution of described electroless Ni-P-PTFE composite coating comprises following components:
[0064] Nickel sulfate 15g / L;
[0065] Sodium hypophosphite 20g / L;
[0066] Sodium citrate 4g / L;
[0067] Lactic acid 8ml / L;
[0068] Sodium acetate 8g / L;
[0069] Cationic surfactant 0.3g / L;
[0070] Concentration is 60wt% PTFE 6ml / L.
Embodiment 3
[0072] The plating solution of described electroless Ni-P-PTFE composite coating comprises following components:
[0073] Nickel sulfate 35g / L;
[0074] Sodium hypophosphite 45g / L;
[0075] Sodium citrate 12g / L;
[0076] Lactic acid 25ml / L;
[0077] Sodium acetate 25g / L;
[0078] Cationic surfactant 0.8g / L;
[0079] Concentration is 60wt% PTFE 18ml / L.
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