Ultraviolet thick-film photoresist and film-forming resin thereof

A technology of film-forming resin and phenolic resin, applied in optics, optomechanical equipment, instruments, etc., can solve problems such as film cracking, difficult removal of film, and molecular chain stiffness, etc., to prevent film cracking and increase adhesion Effect

Active Publication Date: 2011-02-16
SUZHOU RUIHONG ELECTRONIC CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The negative UV photoresist generally used at present, because the highly cross-linked molecular chain is very stiff, it is easy to generate internal stress in the subsequent process, and the phenomenon of pattern deformation, film cracking and even falling off occurs, which cannot meet the process requirements
In addition, it is difficult to remove the cross-linked adhesive film in the subsequent de-adhesive process, often encountering troubles

Method used

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  • Ultraviolet thick-film photoresist and film-forming resin thereof
  • Ultraviolet thick-film photoresist and film-forming resin thereof
  • Ultraviolet thick-film photoresist and film-forming resin thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1 12

[0054] Embodiments 1-12: Silicon-containing I-line ultraviolet photoresist and film-forming resin thereof

[0055] 1. Phenolic resin part:

[0056] (1), the monomer of phenolic resin and its mass fraction in film-forming resin are shown in the following table:

[0057]

Addition Polycondensation Monomer

Embodiment one

m-cresol, p-cresol, formaldehyde

Embodiment two

m-cresol, o-cresol, formaldehyde

Embodiment three

m-cresol, o-cresol, formaldehyde

Embodiment Four

m-cresol, p-cresol, o-cresol, formaldehyde

Embodiment five

m-cresol, p-cresol, 3,5-dimethylphenol, formaldehyde

Embodiment six

m-cresol, 2,4-dimethylphenol, formaldehyde

Embodiment seven

o-cresol, p-cresol, 2,3,5-trimethylphenol, formaldehyde

Embodiment Eight

3,5-Dimethylphenol, formaldehyde

Embodiment nine

o-cresol, 2,4-dimethylphenol, formaldehyde

Embodiment ten

2,3,5-Trimethylphenol, formaldehyde ...

Embodiment 1

[0080] Example 1: KH-570 silane coupling agent, the chemical name is γ-(methacryloyloxy)propyltrimethoxysilane, and the structural formula is CH 2 =CC(CH 3 )COO(CH 2 ) 3 Si(OCH 3 ) 3

Embodiment 2

[0081] Embodiment two: trimethoxyethylsilane acrylate, the structural formula is:

[0082] CH 2 =CHCOO(CH 2 ) 2 Si(OCH 3 ) 3

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PUM

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Abstract

The invention discloses an ultraviolet thick-film photoresist. The photoresist is mainly prepared by the following steps of: mixing 10 to 35 parts of phenolic resin, 1 to 10 parts of silicon-containing copolymer film-forming resin, 5 to 20 parts of diazo naphthoquinone light-sensitive compound, 30 to 85 parts of solvent and a small number of other additives such as n-butylamine and a surfactant serving as raw materials; and filtering the mixture by using 5-micron, 1-micron and 0.2-micron filters. In a thick-film ultraviolet exposure positive photoresist which is applied to the embossing process of advanced packaging and the manufacturing of micro electro mechanical systems (MEMS) and is prepared by the invention, a one-step film thickness uniform adhesive spinning piece is up to 1 to 20 microns and a multi-step film thickness uniform adhesive spinning piece is up to 50 to 100 microns as required.

Description

technical field [0001] The present invention relates to a kind of thick-film ultraviolet photoresist composition that is applicable to the advanced packaging (silicon wafer level packaging WLP) of large-scale integrated circuit (WLP) and Micro-Electro-Mechanical System (MEMS, Micro-Electronic Machine System) field application and its composition film resin. Background technique [0002] In the preparation process of large-scale integrated circuits, encapsulation is the last process, and encapsulation technology is also developing rapidly like its previous process. The current advanced packaging technology has developed from individual packaging of a single integrated circuit block to simultaneous packaging of the entire silicon chip, that is, wafer level package (WLP). A variety of packaging materials are required in the packaging process, and the thick-film ultraviolet exposure positive photoresist involved in the present invention is a necessary key functional material in...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/039C08L33/12C08L61/10C08L33/08C08L25/14
Inventor 冉瑞成沈吉
Owner SUZHOU RUIHONG ELECTRONIC CHEM CO LTD
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