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Method for preparing lightweight thermal-insulating board from alkali-gelatinized starches used as adhesive, waste plant fibers and polystyrene foams

A technology of polystyrene foam and gelatinized starch, applied in the direction of starch adhesives, adhesive types, flat products, etc., can solve problems such as wall cracking, poor thermal insulation performance, hollowing, etc., and achieve easy scale The effect of chemical production, good thermal insulation performance and simple preparation process

Inactive Publication Date: 2011-11-30
江西南田彩印包装有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Most of the existing thermal insulation materials are polymer thermal insulation materials such as: EPS board, polyurethane board, extruded plastic board, etc. Due to the shrinkage and aging of the polymer material itself, it is easy to cause the wall and the thermal insulation material to be weakly bonded, and the thermal insulation board and the outside of the board Inadequate bonding of the gray layer will cause quality problems such as cracking, hollowing, peeling, peeling, water seepage and other quality problems on the wall surface, reducing or losing the thermal insulation effect
Most of the existing decorative boards use gypsum boards and wood composite boards. Among them, gypsum boards have low strength and are easy to delaminate and fall off, which is relatively heavy; wood composite boards contain formaldehyde that is harmful to humans, and have poor thermal insulation performance and are easy to deform
There are also disadvantages in the existing cargo transportation packaging boards, because most of them are made of wood or corrugated paper and polystyrene foam, so a large amount of raw materials must be consumed

Method used

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  • Method for preparing lightweight thermal-insulating board from alkali-gelatinized starches used as adhesive, waste plant fibers and polystyrene foams

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0008] Embodiment 1: 10g sodium hydroxide is dissolved in tap water, makes the sodium hydroxide solution that mass concentration is 40%; 110g potato starch is mixed with 600ml tap water, makes potato starch milk, under the condition of room temperature and stirring, The sodium hydroxide solution that will make is added dropwise in the potato starch milk, makes alkali-gelatinized potato starch adhesive; Make alkali-gelatinized potato starch adhesive and corrugated box after 230g crushing, 6g polystyrene foam Mix evenly, put the mixed mixture into a mold, and make a light-weight insulation board after molding and drying. The inspection results of the light-weight insulation boards prepared in this embodiment are shown in the table below.

[0009]

example 2

[0010] Example 2: Experimental condition is the same as embodiment 1, and difference is that 130g potato starch is mixed with 700ml tap water, makes potato starch milk.

Embodiment 3

[0011] Embodiment 3: The experimental conditions are the same as in Example 1, except that the alkali-gelatinized potato starch adhesive is mixed evenly with 300 g of pulverized corrugated boxes and 5 g of polystyrene foam.

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Abstract

The present invention discloses a method for preparing a lightweight thermal-insulating board from alkali-gelatinized starches used as adhesive, waste plant fibers and polystyrene foams. The method comprises the followings steps: dropwise adding sodium hydroxide with certain concentration into a starch milk so as to obtain an alkali-gelatinized starch adhesive; then evenly mixing the obtained alkali-gelatinized starch adhesive with the waste plant fibers and the polystyrene foams, and putting the obtained mixture into a mold; carrying out forming and drying on the mixture so as to obtain the lightweight thermal-insulating board. The method disclosed by the present invention is simple in production process and easy to operate; and the lightweight thermal-insulating board prepared by using the method disclosed by the invention does not contain the harmful materials such as formaldehyde, therefore, the lightweight thermal-insulating board is an environmental-friendly lightweight thermal-insulating board.

Description

technical field [0001] The invention relates to a method for preparing a light heat-insulating board, in particular to a method for preparing a light-weight heat-insulating board by using alkali gelatinized starch as a binder, waste plant fiber and polystyrene foam. Background technique [0002] Most of the existing thermal insulation materials are polymer thermal insulation materials such as: EPS board, polyurethane board, extruded plastic board, etc. Due to the shrinkage and aging of the polymer material itself, it is easy to cause the wall and the thermal insulation material to be weakly bonded, and the thermal insulation board and the outside of the board Inadequate bonding of the gray layer will cause quality problems such as cracking, hollowing, peeling, peeling, water seepage and other quality problems on the wall surface, reducing or losing the thermal insulation effect. Existing decorative boards mostly adopt gypsum board and wooden composite board, wherein the gyps...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29D7/00C09J103/02C08L25/06C08L97/02
Inventor 温国华林波张伟目仁更李东芳张思思邢建霞张媛
Owner 江西南田彩印包装有限公司
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