Micro electro mechanical system (MEMS) gyroscope, chip level temperature control method thereof and processing method thereof

A gyroscope and chip technology, which is applied in the direction of speed measurement by gyro effect, instrument, metal material coating process, etc., can solve the problems of unfavorable miniaturization and integration of micro gyroscopes, process incompatibility, and reduce micro gyroscopes, etc., to achieve Easy to integrate and array, omit the refrigeration device, and the process achieves simple effects
CN102042832AInactive Publication Date: 2011-05-04SOUTHEAST UNIV
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
SOUTHEAST UNIV
Publication Date
2011-05-04
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention relates to a micro electro mechanical system (MEMS) gyroscope, a chip level temperature control method thereof and a processing method thereof. A microheater and a temperature sensor are processed on a glass substrate by a micromachining technique; the glass substrate is bonded with an MEMS gyroscope structure chip; the MEMS gyroscope chip is heated by applying voltage at the two ends of the microheater; and the integrated temperature sensor monitors the temperature of the MEMS gyroscope chip in real time so as to drive a peripheral circuit to adjust the voltage at the two ends of the heater and keep the temperature of the gyroscope chip constant and a little higher than the upper limit of the temperature of the working environment. The heater and the temperature sensor are integrated on the glass substrate, the volume is small and the temperature sensitivity is high. The chip level temperature control method has the characteristics of low power consumption, small volume, high applicability and high repeatability, can be compatible with the micromachining process, can realize batch production, and can be widely applied to chip level temperature control of other MEMS chips.
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Description

technical field

[0001] The invention belongs to the field of micro-electromechanical systems (MEMS), and in particular relates to a MEMS gyroscope and a chip-level temperature control method and processing method thereof. Background technique

[0002] A MEMS gyroscope is a typical inertial sensor that measures the angular velocity of an object's rotation. With the continuous improvement of the accuracy of MEMS gyroscopes, the error caused by temperature changes has become one of the main errors of MEMS gyroscopes. Because changes in temperature will cause changes in the material properties, size, and quality factor of the MEMS gyroscope, these changes will cause a sharp decline in the performance of the MEMS gyroscope. Therefore, correcting the temperature error of the MEMS gyroscope is very important for improving the performance of the MEMS gyroscope.

[0003] There are many compensation and correction methods for MEMS gyroscope temperature error, and there are three com...

Claims

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