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Eddy current metal film thickness end point detection device

An endpoint detection, metal film technology, applied in metal processing equipment, grinding machine parts, grinding/polishing equipment, etc., can solve the problem of polishing liquid leakage, to solve leakage, accurate endpoint detection, improve measurement The effect of precision

Active Publication Date: 2011-05-11
TSINGHUA UNIV
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Problems solved by technology

[0003] The purpose of the present invention is to provide a device for detecting the end point of the thickness of the eddy current metal film in the chemical mechanical polishing process, which can not only accurately detect the end point, but also make the installation and disassembly of the eddy current sensor convenient, and can solve the problems caused by the installation of the eddy current sensor. Leakage of polishing fluid caused by gaps

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[0018] The structure, working principle and working process of the present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0019] The measuring principle of the device is as follows figure 1 As shown, the schematic diagram of the eddy current sensor 60 placed on the metal film 21 to be tested is shown as figure 1 -a, where h is the lift-off height, c is the film thickness, r 1 and r 2 are the inner and outer diameters of the coil, and σ is the electrical conductivity of the metal film. The equivalent circuit of this model is as figure 1 As shown in -b, its circuit loop 82 is the equivalent circuit of the metal film to be tested, and the circuit principle is as figure 1 -c, the calculation control unit calculates and processes the change signal of the inductance L at both ends of the eddy current sensor 60 through the front circuit, and obtains a relationship curve of the equivalent inductance of the eddy current se...

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Abstract

The invention provides an eddy current metal film thickness end point detection device belonging to the technical field of chemically mechanical polishing process equipment of integrated circuits. The eddy current metal film thickness end point detection device comprises an eddy current sensor, a conducting sliding ring, a conducting fixed ring, a multiple-frequency signal generating unit, a front end circuit and a computation control unit including data processing and controlling programs, wherein the eddy current is arranged in a polishing platform of a polishing machine and in a step hole below a polishing pad corresponding to a workpiece, the eddy current sensor comprises a coil, a shell and a gland nut; the multiple-frequency signal generating unit provides a pumping signal for the eddy current sensor; and because an inductance change signal of the eddy current sensor, caused by the change of the thickness of a metal film, is input to the computation control unit through the front end circuit, the conducting sliding ring and the conducting fixed ring, the influence of the lift-off value change caused by the vibration to the end point detection can be overcome, and accurate end point detection is provided; meanwhile, the eddy current sensor is convenient for assembly and disassembly, and the problem of leakage of polishing liquid, caused by an installing gap of the eddy current sensor, can be solved.

Description

technical field [0001] The invention relates to the technical field of integrated circuit chemical mechanical polishing (CMP), in particular to an eddy current metal film thickness endpoint detection device in the chemical mechanical polishing process. Background technique [0002] With the rapid development of integrated circuit (IC) manufacturing technology, the characteristic line width has reached below 45nm, the wafer size has reached more than 300mm in diameter, and the metal layer wiring has reached more than 13 layers. The eddy current method is more suitable, but the existing eddy current terminal The detection device only includes an eddy current sensor, a signal generator and an impedance analyzer, and uses one operating frequency. The change in coil impedance is used to determine the endpoint value. Since the polishing disc and the wafer are rotating during the CMP process, the lift-off height (that is, the distance between the eddy current sensor and the measur...

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Application Information

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IPC IPC(8): B24B49/10
Inventor 孟永钢曲子濂乐承宁赵德文赵乾路新春
Owner TSINGHUA UNIV
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