Aluminum alloy material and preparation method of aluminum alloy backboard for LED (Light-Emitting Diode) chip

Abstract

The invention discloses an aluminum alloy material for preparing a backboard for cooling and encapsulating an LED (Light-Emitting Diode) chip. The aluminum alloy material is made from an aluminum alloy raw material which is prepared from the following components in percentage by weight: 1.0-2.2 percent of Mn, 2.7-3.3 percent of Zn, 0.5-1.2 percent of Fe, 0.4-0.6 percent of Mg, 0.05-0.1 percent of Cu, 0.8-1.2 percent of Co and the balance of Al. The aluminum alloy material provided by the invention has good cooling performance and the thermoconductivity of 150-210 W / m DEG C. Meanwhile, the invention also provides a preparation method of the aluminum alloy backboard for the LED chip. The method comprises the following steps of: putting the aluminum alloy raw material in a heating furnace, heating and melting, and casting and molding the molten aluminum alloy raw material to form the aluminum alloy backboard, thereby improving the utilization rate of the raw materials and decreasing the preparation cost of the backboard.

Description

technical field [0001] The invention relates to the technical field of LED packaging, in particular to an aluminum alloy material and a preparation method of an aluminum alloy backplane for LED chips. Background technique [0002] A light-emitting diode (LED, Light Emitting Diode) is a semiconductor solid-state light-emitting device, which uses a semiconductor PN junction as a light-emitting material, and can directly convert electricity into light. When a forward voltage is applied to both ends of the semiconductor PN junction, the minority carriers injected into the PN junction recombine with the majority carriers, releasing excess energy to cause photon emission, and the direct emission colors are red, orange, yellow, Green, blue, blue, purple light. Due to the advantages of high energy saving, long life, and environmental protection, LED light sources have become a research hotspot at present, are widely used in lighting fixtures, and are considered to be the next gener...

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Problems solved by technology

However, the thermal conductivity of aluminum is poor, and its thermal conductivity is less than or equal to 92W / m℃; although the thermal conductivity of copper is very good, the disadvantage of using copper as the backplane is large deformation and high cost.

[0006] For aluminum alloys, the existing aluminum alloys are common industrial aluminum alloys, whose main components are Al, Si, Mg, Cu, etc., and the high content of Si and Mg makes its thermal conductivity poor, and its thermal conductivity is less than It is equal to 92W / m℃, and it is easy to deform after being heated; and the preparation method of the existing industrial aluminum alloy backplane is usually forging

[0007] The so-called forging is a processing method that uses forging machinery to apply pressure to solid metal to cause plastic deformation to obtain forgings with certain mechanical properties, certain shapes and sizes; since forging does not have a melting process, it is not easy to mix impurities in the process. Therefore, it is mainly used for processing plates, that is, for aluminum alloys, it is necessary to prepare aluminum alloy solids first, and then use forging machinery to apply pressure to the aluminum alloy solids to cause plastic deformation to obtain certain mechanical properties, certain shapes and certain dimensions. Aluminum alloy back plate; the disadvantage of forging is that the material utilization rate is low, and it may cause plate cracking problems, so the manufacturing cost is high

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