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Curable resin composition

A curable resin and composition technology, applied in the direction of polyether adhesives, adhesive types, other chemical processes, etc., can solve the problem that the curing speed cannot meet the practical application, and achieve the goal of reducing environmental load and ensuring safety Effect

Inactive Publication Date: 2013-05-15
KONISHI CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the curing speed of these curing catalysts cannot meet the practical application

Method used

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  • Curable resin composition
  • Curable resin composition
  • Curable resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0091] Hereinafter, the present invention will be described in detail based on examples, but the present invention is not limited to these examples.

Synthetic example 1

[0092] (Synthesis Example 1) Synthesis of Curable Resin A-1

[0093] In the reaction vessel, N-(2-aminoethyl)-3-aminopropyltrimethoxysilane (222.4 g, 1.0 mol) was stirred at room temperature under a nitrogen atmosphere, and methyl acrylate ( 172.2 g, 2.0 mol), and the reaction was carried out at 80° C. for 10 hours to obtain a silane compound SE-1 having a trimethoxysilyl group and a secondary amino group in the molecule.

[0094] "PML S 4012" (manufactured by Asahi Glass Polyurethane Co., Ltd., polyoxypropylene polyol, average molecular weight 10000, 950 g), "PR-3007" (manufactured by Asahi Denka Kogyo Co., Ltd., propylene oxide and cyclo Copolymerization polyol of oxyethane, average molecular weight 3000, 50g), isophorone diisocyanate (53.3g) and dibutyltin dilaurate (50mg), stir and mix under nitrogen atmosphere, make reaction at 80 ℃ simultaneously This was carried out for 3 hours to obtain urethane resin U-1 whose main chain is an alkylene oxide polymer and which has an ...

Embodiment 1～4、 comparative example 1、2

[0098] 〔Study on appropriate compounding amount〕

[0099] As the curable resin (A), a modified silicone resin "Excestar S2420" (manufactured by Asahi Glass Co., Ltd.) whose main chain is polyoxypropylene and has a methyldimethoxysilyl group as a crosslinkable group at the end was used, As the curable resin (B), used was "GENIOSIL STP-E30" (manufactured by Wacker Chemie AG., manufactured by Wacker Chemie AG.) whose main chain was polyoxypropylene and had a methyldimethoxysilyl type α-silyl structure at the end. Molecular weight in methoxy equivalent conversion is about 16000, viscosity is about 30000mPa·s / 25°C), 3-aminopropyltrimethoxysilane is used as the aminosilane compound (C), and the compounding ratio shown in Table 1 is used (Numbers represent parts by mass), mixed rapidly for 1 minute to prepare a curable resin composition, and measured the skinning time (skinning time).

[0100] The skinning time is calculated as follows. Place the curable resin composition in an envi...

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PUM

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Abstract

Disclosed is a curable resin composition with reduced environmental burden, which is safe and has a sufficient curing rate. The composition contains a curable resin (A) having a hydrolyzable silicon group (1) in each molecule, a curable resin (B) having a hydrolyzable silicon group (2) in each molecule, and at least one kind of aminosilane compound (C) which is a compound (3), a condensation product of the compound (3) by itself or a condensation product of the compound (3) and another silane compound, at a specific ratio.     -X-SiR1 a(OR2)3-a     (1)     -A-CH2-SiR3 b(OR4)3-b     (2)     R5R6N-R7-SiR8 c(OR9)3-c     (3) (In the formulae, X represents a hydrocarbon group having 2 or more carbon atoms; A represents a bonding functional group wherein a heteroatom having an unshared electron pair is bonded to CH2 which is bonded to Si contained in the hydrolyzable silicon group; R1, R2, R3, R4, R8 and R9 each represents an alkyl group having 1-20 carbon atoms; R5 and R6 each represents an organic group or a hydrogen atom; R7 represents an organic group wherein a heteroatom is not bonded to C which is bonded to a hydrolyzable silicon atom; and a, b, c each represents 0, 1 or 2.)

Description

technical field [0001] The present invention relates to a curable resin composition containing a hydrolyzable silicon group that can be cured at room temperature and atmosphere, and more specifically, to curing that can reduce environmental loads while ensuring safety and having a necessary and sufficient curing speed permanent resin composition. Background technique [0002] Curable resins having a hydrolyzable silicon group in their molecules are widely used as base polymers for sealants, adhesives, adhesives, coatings, and the like. Since the hydrolyzable silicon group is hydrolyzed and cross-linked by moisture in the atmosphere, the curable resin is cured, so it is also called a moisture-curable resin. In particular, curable resins whose hydrolyzable silicon groups are alkoxysilyl groups are widely used because of their high safety and low odor (Patent Document 1 and Patent Document 2). [0003] However, since a sufficient curing rate at room temperature cannot be obta...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L101/10C08K5/544C08K5/57C08L33/04C08L71/02C09J171/02C09K3/10
CPCC09K3/1018C08K5/544C08G65/336C08L71/02C08L33/04C08L101/10C09K3/10C09J201/10C08K5/541
Inventor 楠木孝治乾纯野村幸弘杉山茂树佐藤慎一
Owner KONISHI CO