Electrolytic gold plating solution and gold film obtained using same

A technology for electroplating gold and gold film, applied in the field of gold film, can solve problems such as difficulty, impracticality, consumption, etc., and achieve a good effect of gold precipitation

Active Publication Date: 2011-06-22
JAPAN PURE CHEM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, since the part to be plated and the part not to be plated must be made in one part, there is a problem that even if the part that does not require gold plating is pressed mechanically with a member such as silicone rubber, it is completely prevented for the plating device. It is also very difficult for the plating solution to leak into the part
However, this technology does not have sufficient performance in the selectivity of gold deposition, and since reducing hexamethylenetetramine is added to the gold plating bath, gold is abnormally deposited in the gold plating bath, and gold adheres to The shaft of the pump used to circulate the plating solution, causing the pump to stop, or the gold to be consumed outside of the plating reaction, is very uneconomical and impractical
[0007] In recent years, due to the miniaturization of electronic equipment, it is necessary to clearly distinguish between the parts that are gold-plated and the parts that are not gold-plated, but this cannot be achieved with the existing technology, and further improvement is required

Method used

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  • Electrolytic gold plating solution and gold film obtained using same
  • Electrolytic gold plating solution and gold film obtained using same
  • Electrolytic gold plating solution and gold film obtained using same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～10、 comparative example 1～12

[0086] With respect to all the gold plating solutions, 9 g / L of potassium gold cyanide was dissolved in terms of gold, and 200 ppm of cobalt salts, nickel salts, or iron described in each of the examples and comparative examples shown in Table 1 were dissolved in terms of metal. For the salt, dissolve 1000ppm of a specific heterocyclic compound or its comparative compound, dissolve 100g / L of citric acid as a component serving as both a conductive salt and a buffer, adjust the pH to 4.3, and prepare a gold plating solution.

[0087] As the "comparative compound", hexamethylenetetramine, a benzene ring compound in which one or more nitro groups were substituted on the carbon atoms in the ring, and a heterocyclic compound in which a nitro group was not substituted were used. In addition, the pH was adjusted with a 20% by mass potassium hydroxide aqueous solution and citric acid, the bath temperature of the gold plating solution was set at 50° C., and the following evaluations were...

Embodiment 11

[0089] Except not containing metal salts such as cobalt salts, nickel salts, iron salts, etc. except gold salts, prepare the electroplating gold solution in the same manner as in Example 1, implement electroplating in the same manner as in Example 1, and perform the following steps in the same manner. evaluate.

[0090]

[0091] Using the gold plating solution prepared in each of the Examples and Comparative Examples, gold was electroplated on a 2.0 μm primary bright nickel plating film on a 10 mm×10 mm copper plate according to the procedure shown in Table 2. For electroplating gold, the electroplating solution is agitated by the pump jet flow (hereinafter referred to as "jet flow type gold plating method") at a flow rate of 18L per minute from a circular jet outlet with a diameter of 8mm, while the current density is 5A / dm 2 、40A / dm 2 The two levels were electroplated with gold for 10 seconds each.

[0092] In addition, for the primary bright nickel plating film, the f...

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Abstract

The problem is to provide an electrolytic gold plating solution suitable for nickel barrier plating while maintaining the excellent properties of the gold plating film, e.g., mechanical characteristics, corrosion resistance, and electrical characteristics, that is, the problem is to provide an electrolytic gold plating solution capable of manufacturing a stable product that limits gold depositionat 'portions not requiring gold plating (nickel barrier portions)' where members are mechanically constrained, and ensures satisfactory gold deposition in portions requiring gold plating, without extraneous deposition of the gold. The aforementioned problem is solved by means of an electrolytic gold plating solution that contains a gold cyanide salt as the gold source, and a heterocyclic compoundhaving one or more nitrogen atoms in the ring and one or more nitro groups replacing a carbon atom in said ring, and by means of a gold film that is obtained by electrolytic gold plating onto a nickel film using the aforementioned electrolytic gold plating solution.

Description

technical field [0001] The present invention relates to a gold electroplating solution with a specific composition and a gold film on a nickel film obtained by using the gold electroplating solution. Background technique [0002] Gold plating on a nickel film is widely used in the fields of electronic and electrical components because gold has excellent corrosion resistance, mechanical properties, electrical properties, etc., and nickel has excellent heat resistance as a base metal. Among them, hard gold plating alloyed with metals such as cobalt and nickel is widely used as gold plating for contact junctions of insert members such as connectors and contact members such as switches, taking advantage of its high hardness and excellent wear resistance. [0003] In recent years, due to the miniaturization of electronic equipment, insertion members such as connectors and contact members such as switches have also been miniaturized and their shapes have become more complicated. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/48C25D7/00H01R13/03C25D3/62C25D5/08C25D5/12
CPCC25D3/48C25D3/62C25D5/12C25D5/627
Inventor 清水茂树高崎隆治清原欢三山本幸弘下田贤一
Owner JAPAN PURE CHEM
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