Wash solution for removing laser damage layers
A technology of laser damage and lotion, applied in sustainable manufacturing/processing, electrical components, climate sustainability, etc., to achieve the effect of increasing opening voltage and reducing leakage current
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Embodiment 1
[0008] Add 80g of ammonium fluoride, 20ml of 49% hydrofluoric acid solution and 20ml of 65% nitric acid solution into 1L of water to make a washing solution for removing the laser damage layer, and use the washing solution to treat single crystal silicon wafers (type P, with a resistivity of 0.5- 3), after alkali texturing (pyramid), diffusion (SHR=70), post-cleaning (removing edge PN junction and backside etching), PECVD, front-side laser doping (ShR=5-10ohm), and removing the damaged layer , Suns-Voc test.
Embodiment 2
[0010] Add 60g of ammonium fluoride, 10ml of 49% hydrofluoric acid solution and 10ml of 68% nitric acid solution into 1L of water to make a washing solution for removing the laser damage layer, and use the washing solution to treat single crystal silicon wafers (type P, with a resistivity of 0.5- 3), after alkali texturing (pyramid), diffusion (SHR=70), post-cleaning (removing edge PN junction and backside etching), PECVD, front-side laser doping (ShR=5-10ohm), and removing the damaged layer , Suns-Voc test.
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