Microcrystalline glass ceramic material for substrate and preparation method of microcrystalline glass ceramic material

Abstract

The invention relates to a microcrystalline glass ceramic material for a substrate and a preparation method of the microcrystalline glass ceramic material, belonging to the field of ceramic materials. The microcrystalline glass ceramic material consists of high-temperature fused calcium borosilicate glass and a modified additive, wherein the modified additive comprises B2O3, La2O3, SiO2 and ZnO; in terms of mass percentage, a formula of the material is [100-(a+b+c+d)]G+a B2O3+b La2O3+c SiO2++d ZnO, wherein a is not less than 0.1 and not more than 3.5, b is not less than 0.1 and not more than 5, c is not less than 0 and not more than 10 and d is not less than 0 and not more than 1.5; and G stands for the high-temperature fused calcium borosilicate glass. The high-temperature fused calcium borosilicate glass comprises the following components of: 35-50mol / % of CaO, 10-30mol% of B2O3, 15-50mol% of SiO2, 0-2mol% of ZrO2 and 0-2mol% of TiO2. According to the microcrystalline glass ceramic material, the bending strength (more than 170MPa) of the ceramic material can be well improved and the excellent dielectric property of the ceramic material can be kept.

Description

technical field [0001] The invention relates to a formula of glass-ceramics for substrates and a preparation method thereof, belonging to the field of ceramic materials. Background technique [0002] With the development of miniaturization, thinning, integration and high frequency of electronic equipment, the miniaturization, high density, low resistance of integrated circuit wiring and the low dielectric constant, low thermal expansion rate and high thermal conductivity of substrate materials etc. have put forward more and more stringent requirements. Traditional ceramic substrates usually use Al 2 o 3 , mullite, AlN and other materials, but because the sintering temperature is 1500-1900 ° C, if the simultaneous firing method is adopted, the conductor material can only choose insoluble metals Mo and W, etc., which will inevitably cause a series of difficult problems: (1) Co-firing needs to be carried out in a reducing atmosphere, which increases the difficulty of the pro...

AI Technical Summary

Problems solved by technology

Traditional ceramic substrates usually use Al 2 o 3 , mullite, AlN and other materials, but because the sintering temperature is 1500-1900 ° C, if the simultaneous firing method is adopted, the conductor material can only choose insoluble metals Mo and W, etc., which will inevitably cause a series of difficult problems: (1) Co-firing needs to be carried out in a reducing atmosphere, which increases the difficulty of the process. The sintering temperature is too high, and a special sintering furnace is required. (2) Due to the high resistivity of Mo and W, the wiring resistance is large, and the signal transmission is easy to cause Distortion, increased loss, and limited wiring miniaturization (3) The dielectric constant of the dielectric material is too large, so it will increase the signal transmission delay time, especially not suitable for ultra-high frequency circuits

The glass-ceramic material invented by this patent is mainly used in chip inductors, so the bending strength value of the material is not specified

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