Resin composition for printed wiring board

A printed circuit board and resin composition technology, which is applied in the direction of printed circuit, printed circuit manufacturing, printed circuit parts, etc., can solve unsatisfactory, unsatisfactory changes in elastic modulus, warping or cracking of printed circuit boards and other problems, to achieve the effect of small temperature change, excellent solvent resistance, excellent heat resistance and solvent resistance

Inactive Publication Date: 2011-10-05
AJINOMOTO CO INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, changes in elastic modulus accompanying temperature changes do not necessarily satisfy
In addition, even if a thermosetting resin is used together, the printed wiring board may warp or crack, which is unsatisfactory

Method used

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  • Resin composition for printed wiring board
  • Resin composition for printed wiring board
  • Resin composition for printed wiring board

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0156] Add 25 parts by mass of 4,4'-(hexafluoroisopropylidene)-bis-(phthalic di Formic dianhydride) (hereinafter referred to as 6FDA), 69.9 parts by mass of γ-butyrolactone, 7 parts by mass of toluene, 55.7 parts by mass of diaminosiloxane X-22-9409 (manufactured by Shin-Etsu Chemical Co., Ltd.) (amine equivalent 665), 6.7 parts by mass of 2,6-bis(1-hydroxy-1-trifluoromethyl-2,2,2-trifluoroethyl)-1,5-naphthalenediamine (hereinafter referred to as HFA-NAP ), and stirred at 45°C for 2 hours under nitrogen flow to react. Next, the temperature of the reaction solution was raised, and water of condensation was azeotropically removed with toluene under a nitrogen stream while maintaining the temperature at about 160°C. When it was confirmed that a predetermined amount of water had accumulated in the moisture quantitative receiver and no outflow of water was observed, the temperature was further increased, and the mixture was stirred at 200° C. for 1 hour. Thereafter, cooling was t...

Synthetic example 2

[0159] In a 500mL detachable flask equipped with a moisture quantitative receiver connected to a reflux cooler, a nitrogen introduction tube, and a stirrer, add 32 parts by mass of 6FDA, 28.6 parts by mass of γ-butyrolactone, 28.6 parts by mass of Ipsole 150, and 7 parts by mass of toluene , 50.1 parts by mass of diaminosiloxane KF-8010 (manufactured by Shin-Etsu Chemical Co., Ltd.) (430 amine equivalents), and 6.3 parts by mass of HFA-NAP were stirred and reacted at 45° C. for 2 hours under a nitrogen stream. Next, the temperature of the reaction solution was raised, and water of condensation was azeotropically removed with toluene under a nitrogen stream while maintaining the temperature at about 160°C. When it was confirmed that a predetermined amount of water had accumulated in the moisture quantitative receiver and no outflow of water was observed, the temperature was further increased, and the mixture was stirred at 200° C. for 1 hour. Thereafter, cooling was terminated,...

Synthetic example 3

[0162] In a 500mL detachable flask equipped with a moisture quantitative receiver connected to a reflux cooler, a nitrogen introduction tube, and a stirrer, add 23 parts by mass of 3,3',4,4'-benzophenone tetracarboxylic dianhydride (hereinafter , called BTDA), 30.9 parts by mass of γ-butyrolactone, 30.9 parts by mass of Ipsole 150, 7 parts by mass of toluene, 49.0 parts by mass of diaminosiloxane KF-8010 (manufactured by Shin-Etsu Chemical Co., Ltd.) (amine equivalent 430) , stirred at 45°C for 1 hour under nitrogen flow, and then added 3,3'-bis(1-hydroxyl-1-trifluoromethyl-2,2,2-trifluoroethyl)-4,4' - 6.1 parts by mass of methylene diphenylamine (hereinafter, referred to as HFA-MDA) was stirred at 45° C. for 2 hours to react. Next, the temperature of the reaction solution was raised, and water of condensation was azeotropically removed with toluene under a nitrogen stream while maintaining the temperature at about 160°C. When it was confirmed that a predetermined amount of w...

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Abstract

Disclosed is a resin composition for printed wiring boards that comprises (A) a polyimide resin that has hexafluoroisopropanol groups and a siloxane structure and (B) a heat curable resin. The resin composition has excellent solvent resistance and excellent heat resistance with little temperature variation in the modulus of elasticity.

Description

【Technical field】 [0001] The present invention relates to a resin composition for printed wiring boards containing (A) a polyimide resin having a hexafluoroisopropanol group and a siloxane structure, and (B) a thermosetting resin. 【Background technique】 [0002] Polyimide resins excellent in heat resistance are widely used in the fields of electronics, aerospace, and the like. [0003] Hitherto, a siloxane structure has been introduced into this polyimide resin to develop a material having both heat resistance and low elasticity (Patent Document 1). However, the solvent resistance is not necessarily satisfactory. [0004] In order to improve this, it is reported that a composition containing a polyimide resin introduced with phenolic hydroxyl groups, having siloxane Structured polyimide and epoxy resin (Patent Document 2). However, the change in elastic modulus accompanying temperature change is not necessarily satisfied. In addition, even if a thermosetting resin is used...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/08B32B15/088B32B27/34C08G73/10C08J5/24C08K3/00C08L63/00C09J7/02C09J11/04C09J163/00C09J179/08H05K1/03H05K3/28C09J7/28
CPCC08G73/106C08L79/08C08G73/1039C08G73/1042C09J2463/00C08L63/00C08G73/1082C08G73/1064C09J7/0242C08J5/24C09J7/0292H05K3/285H05K1/0346C08G73/1075C08J2379/08C09J2203/326C09J2400/163C09J2479/08C09J179/08C09D11/00C09J7/35C09J7/22C09J7/28C08J5/244C08J5/246C08J5/249C08L2666/20C08K3/013B32B15/088C09J7/00H05K1/03
Inventor 织壁宏相坂刚充阪内启之萩原勇士成塚智
Owner AJINOMOTO CO INC
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