Alkaline non-cyanide copper plating solution with main coordination agent of methylenediphosphonate

A methylene diphosphonic acid, cyanide-free copper plating technology, applied in the field of surface treatment, can solve the problems of poor adhesion between the coating and the substrate, unstable operation of the HEDP bath, environmental pollution, etc., and reach the copper reduction reaction potential range. Wide range of current density, simple formula effect

Inactive Publication Date: 2011-11-16
HANGZHOU AMAER TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The invention provides an alkaline cyanide-free copper plating solution that does not contain cyanide, which solves the serious environmental pollution caused by the cyanide-containing plating solution in the prior art, and the cyanide-free plating solution causes poor bonding between the coating and the substrate Good, long-term operation instability of HEDP plating solution and other problems

Method used

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  • Alkaline non-cyanide copper plating solution with main coordination agent of methylenediphosphonate
  • Alkaline non-cyanide copper plating solution with main coordination agent of methylenediphosphonate
  • Alkaline non-cyanide copper plating solution with main coordination agent of methylenediphosphonate

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Effect test

Embodiment 1

[0013] An alkaline cyanide-free copper plating solution composed of methylene diphosphonic acid as the main complexing agent was prepared according to the following proportions.

[0014]

[0015] Dissolve and mix the weighed methylene diphosphonic acid and copper sulfate pentahydrate with deionized water respectively, add potassium hydroxide solution while stirring, and finally add a certain amount of potassium carbonate and stir until completely dissolved.

[0016] In the obtained solution, adjust the temperature of the solution to 30°C, and take the cathode current density as 1A / dm 2 A copper coating of about 5 microns is plated on a steel wire substrate with a diameter of Φ2 mm, and the electroplating time is 15 minutes. The binding force is tested by the winding method according to ASTM B452-2002.

Embodiment 2

[0018] An alkaline cyanide-free copper plating solution composed of methylene diphosphonic acid as the main complexing agent was prepared according to the following proportions.

[0019]

[0020]

[0021] Dissolve and mix the weighed methylene diphosphonic acid and copper chloride dihydrate with deionized water respectively, add sodium hydroxide solution while stirring, and finally add a certain amount of sodium carbonate and stir until completely dissolved.

[0022] In the obtained solution, adjust the temperature of the solution to 40°C, and take the cathode current density as 2A / dm 2 Copper plating of about 5 microns is plated on a steel wire substrate with a diameter of Φ2 mm, and the electroplating time is 7 minutes. The bonding force is tested by the winding method according to ASTMB452-2002.

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Abstract

The invention provides an alkaline copper plating solution with a main coordination agent of methylenediphosphonate, and relates to non-cyanide electroplating field. The plating solution comprises the following components: methylenediphosphonate (MDP) with concentration of 30-100 g/L, cupric ion with concentration of 3-25 g/L, and carbonate ion with concentration of 10-80 g/L. By using sodium hydroxide or potassium hydroxide, pH value of the solution is adjusted to 7.5-13.5. The plating solution in the invention has the characteristics of simple formula, no cyanide pollution, small concentration polarization generated in an electroplating process, good stability of the plating solution, and wide allowable current density range. By using the plating solution to plate copper on iron matrix, zinc matrix, zinc alloy matrix or aluminium zinc galvanizing directly, a copper plating layer with good bonding force with the matrix is obtained.

Description

(1) Technical field [0001] The invention relates to a new alkaline cyanide-free copper plating solution, especially an alkaline cyanide-free copper plating solution with methylene diphosphonic acid (MDP) as the main complexing agent, which is used for iron, zinc or zinc Metal substrates such as alloys and galvanized aluminum are directly plated with copper, and can also be used for thickening the copper plating, which belongs to the technical field of surface treatment. (2) Background technology [0002] Because the acidic copper sulfate electroplating solution will directly plate copper on iron, zinc or zinc alloy, aluminum and other metal substrates, a displacement reaction will occur, resulting in poor bonding between the substrate and the copper coating. In order to obtain high binding force, alkaline cyanide plating solution is widely used in industry now. However, due to the very high biological toxicity of cyanide, it will cause major environmental and social safety ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/38
Inventor 姜力强郑精武乔梁王鑫蔡伟孙莉
Owner HANGZHOU AMAER TECH
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