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Halogen-free flame-retardant epoxy resin composition and prepreg and printed circuit board made therefrom

A halogen epoxy resin and epoxy resin technology, which is applied in the field of epoxy resin compositions, can solve the problems of reducing the solder dip resistance of substrates, poor electrical characteristic dissipation factor and dielectric constant, and reducing the adhesion of copper foil to substrates, etc. Achieve good dip solder resistance and avoid brittleness problems

Active Publication Date: 2014-10-22
TAIWAN POWDER TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the addition of such polymer thermoplastic resins will significantly reduce the dip soldering resistance of the substrate, and have adverse effects on electrical properties such as dissipation factor (Df), dielectric constant (Dk), etc., and will also make copper foil Reduced adhesion to substrate

Method used

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  • Halogen-free flame-retardant epoxy resin composition and prepreg and printed circuit board made therefrom
  • Halogen-free flame-retardant epoxy resin composition and prepreg and printed circuit board made therefrom
  • Halogen-free flame-retardant epoxy resin composition and prepreg and printed circuit board made therefrom

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] 100 parts by weight of phosphorus-containing (DOPO) o-cresol novolac epoxy resin, 15 parts by weight of styrene-maleic anhydride copolymer, 40 parts by weight of polymethyl phosphate 1,3-phenylene ester, 0.5 parts by weight Parts of 2-methylimidazole and 15 parts by weight of silicon dioxide were mixed using a stirrer at room temperature for 60 minutes, and then 30 parts by weight of methyl ethyl ketone was added. After the above materials were stirred at room temperature for 120 minutes, a halogen-free flame-retardant epoxy resin composition varnish was formed.

Embodiment 2

[0033] 100 parts by weight of phosphorus-containing (DOPO) o-cresol novolac epoxy resin, 15 parts by weight of styrene-maleic anhydride copolymer, 30 parts by weight of polymethyl phosphate 1,3-phenylene ester, 0.5 parts by weight Parts of 2-methylimidazole and 15 parts by weight of silicon dioxide were mixed using a stirrer at room temperature for 60 minutes, and then 30 parts by weight of methyl ethyl ketone was added. After the above materials were stirred at room temperature for 120 minutes, a halogen-free flame-retardant epoxy resin composition varnish was formed.

Embodiment 3

[0035] 100 parts by weight of phosphorus-containing (DOPO) o-cresol novolac epoxy resin, 15 parts by weight of styrene-maleic anhydride copolymer, 60 parts by weight of polymethyl phosphate 1,3-phenylene ester, 0.5 parts by weight Parts of 2-methylimidazole and 15 parts by weight of silicon dioxide were mixed using a stirrer at room temperature for 60 minutes, and then 30 parts by weight of methyl ethyl ketone was added. After the above materials were stirred at room temperature for 120 minutes, a halogen-free flame-retardant epoxy resin composition varnish was formed.

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Abstract

The invention discloses a halogen-free fire resistance epoxy resin composite comprising halogen-free epoxy resin (a), styrene-maleic anhydride copolymer (b) serving as a hardening agent, polymethyl methacrylate phosphoric acid 1,3-phenylene ester (c) serving as a fire retardant, a hardening accelerator (d) and an inorganic filling agent (e).

Description

technical field [0001] The invention relates to an epoxy resin composition, especially a halogen-free flame-retardant epoxy resin composition and a prepreg (Prepreg) and a printed circuit board made of it. During processing such as cutting the prepreg or drilling the printed circuit board, the amount of rubber shavings or dust falling is significantly reduced. Background technique [0002] With the consideration of the flame retardancy of electronic materials, it is known that electronic components will use bromine-containing raw materials to increase their flame-retardant effect. The resin raw materials for manufacturing printed circuit boards have been changed from bromine-containing epoxy resins to nitrogen- or phosphorus-containing epoxy resins. [0003] The most important substrate of a general printed circuit board is copper clad laminate (CCL for short), and the copper clad substrate is based on a reinforcing material such as fiber paper or glass cloth, and in this s...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08L63/04C08L35/06C08L85/02B32B15/092H05K1/03
Inventor 徐玄浩
Owner TAIWAN POWDER TECH CO LTD
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