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Heat-curable ink composition

A thermosetting, composition technology, used in the field of electronics, which can solve the problem of expensive special fillers

Inactive Publication Date: 2011-11-23
SHOWA DENKO KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in this method, there is a problem that special fillers are expensive

Method used

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Examples

Experimental program
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Effect test

Embodiment

[0073] Hereinafter, the present invention will be more specifically described based on examples, but the present invention is not limited to these examples.

[0074]

[0075] The configuration and conditions of the GPC apparatus are as follows.

[0076] Pump: Alliance (registered trademark) 2695 manufactured by Waters,

[0077] Differential refractometer: Waters 2410,

[0078] Multi-angle light scattering detector: DAWN (registered trademark) HELEOS8+ (registered trademark) manufactured by Wyatt Corporation,

[0079] Intrinsic viscosity detector: ViscoStar (registered trademark) manufactured by Wyatt Corporation,

[0080] Column: Three Shodex (registered trademark) columns GPC KF805L, GPCKF803L, and GPCKF802.5L manufactured by Showa Denko Co., Ltd. were connected and used.

[0081] Solvent: THF

[0082] The absolute molecular weight and intrinsic viscosity were measured under the conditions of a sample concentration of 0.01 mg / ml, a flow rate of 1.0 ml / min, and a measure...

Synthetic example 1

[0089] "C-1015N" (polycarbonate diol, raw material diol molar ratio: 1,9-nonanediol: 2-methyl-1,8-octanediol=15:85, molecular weight 991) 219.8 g, 2,2-dimethylolbutyric acid (manufactured by Nippon Chemicals Co., Ltd.) which is a carboxyl group-containing dihydroxy compound 42.2 g, 2.4 g of trimethylolethane (manufactured by Mitsubishi Gas Chemical Co., Ltd.) as a trifunctional or higher polyhydric alcohol, 600.0 g of diethylene glycol monoethyl ether acetate (manufactured by Daicel Chemical Co., Ltd.) as a solvent, Heat to 100°C to dissolve all raw materials.

[0090] The temperature of the reaction solution was lowered to 90° C., and methylene bis(4-cyclohexyl isocyanate) (manufactured by Sumika Bayeluretan Co., Ltd. Trademark)) 134.3 g. It was made to react at 120 degreeC for 6 hours, and after confirming that almost all isocyanates disappeared, 2.1 g of isobutanol (made by Wako Pure Chemical Industries, Ltd.) was dripped, and it was made to react at 90 degreeC for 3 hour...

Synthetic example 2

[0095] Into a reaction vessel equipped with a stirring device, a thermometer, and a condenser, UH-CARB80 (registered trademark, a polycarbonate diol derived from 1,6-hexanediol) was added as a polyol compound manufactured by Ube Industries, Ltd. : Number average molecular weight (800) 177.4 g, 2,2-dimethylolpropionic acid (manufactured by Nippon Chemical Industry Co., Ltd.) 38.2 g as a carboxyl group-containing dihydroxy compound, trimethylol as a trifunctional or higher polyol 2.7 g of propane (manufactured by Mitsubishi Gas Chemical Co., Ltd.) and 600.0 g of diethylene glycol monoethyl ether acetate (manufactured by Daicel Chemical Co., Ltd.) as a solvent were heated to 100° C. to dissolve all the raw materials.

[0096] The temperature of the reaction solution was lowered to 90° C., and isophorone diisocyanate ("DesModule-I" (registered trademark) manufactured by Sumika Bayeruretan Co., Ltd.) 113.6 g. It was made to react at 120 degreeC for 6 hours, and after confirming th...

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Abstract

A heat-curable ink composition having an excellent balance among screen printability that prevents the ink from blurring or bleeding during screen printing, reliability concerning electrical insulation, adhesion to ink-receiving materials, etc. The heat-curable ink composition is characterized by containing a thermosetting resin (A) which has an intrinsic viscosity [?] and an absolute molecular weight (M), a relationship between the viscosity and the molecular weight being represented by equation (1) wherein the value of a is less than 0.60. The heat-curable ink composition neither blurs nor bleeds during screen printing. There is no need of excessively using a filler in order to improve printability and, hence, an excellent solder resist and other protective films can be formed at low cost without lowering reliability concerning electrical insulation or adhesion to the ink-receiving material. [?] = K Ma (1) (In equation (1), K is a constant.)

Description

technical field [0001] The present invention relates to a thermosetting ink composition comprising a thermosetting resin (A) in which a of the Mark-Houwink formula representing the relationship between the intrinsic viscosity [η] of the resin and the absolute molecular weight M is less than 0.60. More specifically, it relates to resists for insulation protection that can prevent blurring and bleeding during screen printing, and are excellent in balance between electrical insulation properties and adhesion to coated objects, and are suitable for wiring such as solder resists A thermosetting ink composition for use in protective films such as interlayer insulating films, electronic materials such as electrical insulating materials, IC or super LSI sealing materials, laminated boards, cured products formed from the ink composition, and uses thereof. Background technique [0002] In existing resist inks, as methods for improving screen printability to meet finer pitches, such as...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D11/10C08G18/34H05K3/28
CPCC08L61/28C08G18/44C09D11/102H05K3/285C08G18/0823C08G18/6659H05K2203/124C09D175/04H01B3/18
Inventor 木村和弥海野笃东律子
Owner SHOWA DENKO KK
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