Preparation method of high temperature resistant non-halogen fire resistant ultraviolet curing solder resist ink

A solder mask ink, flame retardant technology, applied in the direction of ink, printed circuit parts, household appliances, etc., can solve the technical limitations of printed circuit boards, high prices and other problems, to improve scratch resistance, improve cross-linking Density, the effect of improving the yield of qualified products

Active Publication Date: 2011-12-21
JIANGSU KUANGSHUN PHOTOSENSITIVITY NEW MATERIAL
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Problems solved by technology

[0005] At present, the domestic PCB industry has also begun to introduce lead-free soldering and lead-free tin blowing (hot air leveling) technology, but it is matched with high-temperature-resistant, halogen-free, flame-retardant solder resist inks that adapt to lead-free technology, whether it is Ultrav

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  • Preparation method of high temperature resistant non-halogen fire resistant ultraviolet curing solder resist ink
  • Preparation method of high temperature resistant non-halogen fire resistant ultraviolet curing solder resist ink
  • Preparation method of high temperature resistant non-halogen fire resistant ultraviolet curing solder resist ink

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[0040] In order to better explain the present invention, the present invention will be further described below in conjunction with specific examples. The formulations of each example are shown in Table 1, wherein Example 1 and Example 2 are comparative reference examples, and the amounts of materials used in each example are weight percentages (%).

[0041] Table 1 specific embodiment

[0042]

[0043] Note*: Color paste is obtained by mixing, dispersing and grinding 15% pigment, 84.6wt.% main resin and 0.4wt.% dispersant.

[0044] All the above examples were prepared according to the following steps: (1) Compounding of the main resin: put acrylate modified novolac epoxy resin and β-hydroxyethyl acrylate modified melamine formaldehyde resin into the resin compounding barrel, and use high-speed dispersion The mixing machine is stirred at a speed of 500~800r / min until it is mixed until uniform; (2) Preparation of color paste: 15% pigment by weight, 84.6% main resin and 0.4% ...

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Abstract

The invention discloses a preparation method of a high temperature resistant non-halogen fire resistant ultraviolet curing solder resist ink, belonging to the technical field of the solder resist ink for the printed circuit board. The innovation of the method is that radiation curing nitrogen-containing phosphide is introduced in the formula of the solder resist ink to be used as the non-halogen flame retardant; beta-hydroxyethyl acrylate modified melamine-formaldehyde resins and acrylate modified novolac epoxy resins are complexed to form the base resins, the base resins are mixed with a reactive monomer, a photoinitiator, a color paste, a filler and an additive, the mixture is used to perform mixing, grinding, filtration and other working procedures and prepare the high temperature resistant non-halogen fire resistant ultraviolet curing solder resist ink. The solder resist ink prepared by the method is characterized by high temperature resistance, high flame resistance, high hardness and no halogen and is mainly suitable for the lead-free soldering technology and lead-free tin blowing (hot air leveling) technology of the printed circuit board.

Description

technical field [0001] A method for preparing a high-temperature-resistant, halogen-free, flame-retardant UV-curable solder resist ink. The invention relates to a UV-curable solder resist ink suitable for printed circuit boards (PCBs), in particular to a radiation-curable solder-resist ink containing Nitrogen phosphide halogen-free flame retardant high-temperature-resistant halogen-free flame-retardant UV-curable solder resist ink has the characteristics of high heat resistance, high flame retardancy, high hardness, and halogen-free, and is mainly used for printed circuit boards The industry's current advanced, environmentally friendly and safe lead-free soldering and lead-free tin blowing (hot air leveling) process. It belongs to the technical field of solder resist ink for printed circuit boards. Background technique [0002] Printed circuit board (PCB) is the substrate on which modern electronic devices install and connect various electronic components. It is the lar...

Claims

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Application Information

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IPC IPC(8): C09D11/10H05K1/02C09D11/03C09D11/101C09D11/107
Inventor 疏亿万冯玉进李有明安丰磊陈宁
Owner JIANGSU KUANGSHUN PHOTOSENSITIVITY NEW MATERIAL
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