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Epoxy resin composition and its prepreg and printed circuit board

A technology of epoxy resin and composition, applied in the directions of printed circuit parts, circuit substrate materials, chemical instruments and methods, etc., can solve the problems that the toughness and heat resistance of the laminate cannot be satisfied, and the chemical resistance of the surface of the laminate cannot be obtained. Significant improvement, etc.

Active Publication Date: 2011-12-28
TAIWAN POWDER TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the combination of various curing agents is constantly being developed. For example, U.S. Patent No. 6,716,530 uses two curing agents of maleimide (Maleimide) and amino triazine phenolic resin (ATN) to mix. The use of these two curing agents will greatly improve the flame retardant properties of the substrates produced, but the toughness and heat resistance of the laminates still cannot meet the needs of existing products, and the laminates produced However, the surface chemical resistance problem still cannot be significantly improved and remains to be solved

Method used

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  • Epoxy resin composition and its prepreg and printed circuit board
  • Epoxy resin composition and its prepreg and printed circuit board
  • Epoxy resin composition and its prepreg and printed circuit board

Examples

Experimental program
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Effect test

Embodiment 1

[0033] With 100 parts by weight of phosphorus-containing (DOPO) o-cresol novolac epoxy resin (brand Kolon 5138), 12 parts by weight of amino triazine novolac resin (Dainippon Chemical, brand LA 7054), 6 parts by weight of Diaminodiphenyl sulfone, 1 part by weight of dicyandiamide, 0.5 parts by weight of 2-methylimidazole and 50 parts by weight of talc were mixed for 60 minutes at room temperature, and then 80 parts by weight of methyl ethyl ketone were added . After the above materials were stirred at room temperature for 120 minutes, an epoxy resin composition varnish was formed.

Embodiment 2

[0035] With 100 parts by weight of phosphorus-containing (DOPO) o-cresol novolac epoxy resin, 10 parts by weight of amino triazine phenol-formaldehyde resin, 8 parts by weight of diaminodiphenyl sulfone, 1 part by weight of dicyandiamide , 0.5 parts by weight of 2-methylimidazole and 50 parts by weight of talc were mixed for 60 minutes at room temperature using a stirrer, and then 80 parts by weight of methyl ethyl ketone was added. After the above materials were stirred at room temperature for 120 minutes, an epoxy resin composition varnish was formed.

Embodiment 3

[0037] With 100 parts by weight of phosphorus-containing (DOPO) o-cresol novolac epoxy resin, 15 parts by weight of amino triazine phenol-formaldehyde resin, 4 parts by weight of diaminodiphenyl sulfone, 1 part by weight of dicyandiamide , 0.5 parts by weight of 2-methylimidazole and 50 parts by weight of talc were mixed for 60 minutes at room temperature using a stirrer, and then 80 parts by weight of methyl ethyl ketone was added. After the above materials were stirred at room temperature for 120 minutes, an epoxy resin composition varnish was formed.

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Abstract

The invention relates to an epoxy resin composition and a prepreg material as well as a printed circuit board prepared by the same. The epoxy resin composition comprises (A) epoxy resin and (B) a composite curing agent, wherein the composite curing agent comprises amino triazine novolac, dicyandiamide and diamino diphenyl sulfone which are mixed according to a specific proportion. In the invention, the amino triazine novolac, the dicyandiamide and the diamino diphenyl sulfone are used as a composite curing agent; and the composite curing agent and the epoxy resin are subjected to crosslinkingreaction to obtain an epoxy composite material with high glass conversion temperature; and a laminated board or the printed circuit board made of the epoxy composite material has high glass conversion temperature and good heat resistance, chemical resistance, toughness, processability and electrical characteristic.

Description

technical field [0001] The invention relates to an epoxy resin composition, in particular to an epoxy resin composition containing a composite curing agent and a prepreg (Prepreg) and a printed circuit board (Printed Circuit Board) made thereof. Background technique [0002] In electronic assembly, the printed circuit board is a critical component. It carries other electronic components and connects the circuit to provide a stable circuit working environment, and the most common printed circuit board substrate is copper clad laminate (Copper Clad Laminate, referred to as CCL), which is mainly composed of resin, Composed of reinforcing material and copper foil. The commonly used resins are: epoxy resin, phenolic resin, polyamine formaldehyde, silicone and Teflon, etc., and the commonly used reinforcing materials are: glass fiber cloth, glass fiber mat, insulating paper, even canvas, flax cloth etc. [0003] Generally, a prepreg is obtained by impregnating a resin varnish i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/62C08G59/56C08L63/00B32B15/092H05K1/03
Inventor 陈宪德林宗贤
Owner TAIWAN POWDER TECH CO LTD