Preparation method of drug-delivery type three-dimensional carbon microelectrode with microfluid channel
A microfluidic channel, carbon microelectrode technology, applied in microstructure technology, microstructure devices, manufacturing microstructure devices, etc., can solve the problems of easy electrochemical corrosion, low electrode thickness, limited charge transfer capacity, etc. Low, enhanced electrode effect, good electrical properties
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Embodiment 1
[0042] In this embodiment, the height of the cylindrical stimulation point made of SU-8 glue is 70 to 100 microns, which is used to stick on the surface of the dura mater of the optic nerve or cerebral cortex to stimulate the optic nerve or cerebral cortex to restore nerve function .
[0043] Such as Figure 1 to Figure 8 As shown, this embodiment includes the following steps:
[0044] Step 1: Clean the silicon wafer 1, use the silicon wafer 1 as the substrate, and grow the first layer of SiO on the polished surface of the silicon wafer by PECVD 2 2. Such as figure 1 shown.
[0045] The silicon chip is N-type or P-type single crystal silicon.
[0046] Step 2, in the first layer of SiO 2 On 2, use LPCVD to grow silicon nitride 3 as the first sacrificial layer, and use PECVD to grow the second layer of SiO on silicon nitride 2 4. Such as figure 2 , image 3 shown.
[0047] The thickness of the first sacrificial layer 3 is 0.15 μm;
[0048] The second layer of SiO...
Embodiment 2
[0071] In this embodiment, the cylindrical stimulation point made of SU-8 glue has a height of 300 to 500 microns, which is used to penetrate the dura mater and stick on the surface of the pia mater to stimulate the optic nerve or cerebral cortex to restore nerve function.
[0072] Such as figure 1 As shown, this embodiment includes the following steps:
[0073] Step 1: Clean the silicon wafer 1, use the silicon wafer 1 as the substrate, and grow the first layer of SiO on the polished surface of the silicon wafer by PECVD 2 2. As shown in figure (a).
[0074] The silicon chip is N-type or P-type single crystal silicon.
[0075] Step 2, in the first layer of SiO 2 On 2, use LPCVD to grow silicon nitride 3 as the first sacrificial layer, and use PECVD to grow the second layer of SiO on silicon nitride 2 4. As shown in Figure (b) (c).
[0076] The thickness of the first sacrificial layer 3 is 0.15 μm;
[0077] The second layer of SiO 2 4 has a thickness of 30 μm;
...
Embodiment 3
[0100] AZ4620 glue is used as the first sacrificial layer to form a microfluidic channel with a depth of 30 microns, which is used to inject medicinal liquid into the living body, reduce the body's rejection reaction to the implanted microneedle, and enhance the efficiency of nerve function repair.
[0101] Such as figure 1 As shown, this embodiment includes the following steps:
[0102] Step 1: Clean the silicon wafer 1, use the silicon wafer 1 as the substrate, and grow the first layer of SiO on the polished surface of the silicon wafer by PECVD 2 2. As shown in figure (a).
[0103] The silicon chip is N-type or P-type single crystal silicon.
[0104] Step 2, in the first layer of SiO 2 On 2, use LPCVD to grow silicon nitride 3 as the first sacrificial layer, and use PECVD to grow the second layer of SiO on silicon nitride 2 4. As shown in Figure (b) (c).
[0105] The thickness of the first sacrificial layer 3 is 0.15 μm;
[0106] The second layer of SiO 2 4 has...
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Abstract
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