Flash memory unit for shared source line and forming method thereof
A technology of flash memory cells and source lines, applied in electrical components, electric solid state devices, circuits, etc., can solve the problems of low programming efficiency of flash memory cells, achieve the effects of improving stress reliability, increasing coupling coefficient, and reducing thickness
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[0038] It can be known from the background art that when the device is scaled down, the performance of the existing flash memory unit sharing the source line is not good enough, and the programming efficiency is relatively low.
[0039] Please refer to figure 1 When programming the existing flash memory cells sharing the source line, the voltage applied to the source line 170 is coupled to the floating gate 120 through the spacer dielectric layer 180, and hot electrons migrate from the drain 101 to the source 102 under the action of the coupling voltage , and is injected into the floating gate 120 during the migration process. In order to ensure the data retention capability of the floating gate 120, the sidewall dielectric layer 180 must have no defects. Due to the limitation of the deposition process, if the thickness of the sidewall dielectric layer 180 is too small, some defects are prone to occur, such as defects such as voids formed in the film. Therefore, the thickness...
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