Device and method for making metal film group holes by using ultra-short pulse laser

Abstract

The invention relates to a device and a method for making metal film group holes by using ultra-short pulse laser. An optical shutter is arranged at the output end of a high-frequency ultra-short pulse laser device, a beam expander is arranged at the output end of the optical shutter, a 45-degree total reflector is arranged at the output end of the beam expander, a vibrating mirror and a scanning field mirror are sequentially arranged at the output end of the 45-degree total reflector, the scanning field mirror is opposite to a working platform, a charge coupled device (CCD) alignment observation system is arranged above the working platform, a group of clamping cylinders are arranged on the working platform, an air blowing system is arranged at one side of the working platform, a dust collecting system is arranged at the other side of the working platform, and a dust collecting system is also arranged below the working platform. By optical focusing of the ultra-short pulse laser device, the focal point is positioned on a metal film material, so that energy of the laser device is efficiently utilized; and by controlling the pulse number and the pulse duration of the ultra-short pulse laser device, the pulse number and the pulse time for forming each metal film aperture are modulated, so that required apertures on each metal film are sequentially machined.

Description

technical field [0001] The invention relates to a device and a method for making a group of holes in a metal thin film with an ultrashort pulse laser, and belongs to the technical field of laser micromachining. Background technique [0002] At present, the group hole production methods include electron beam drilling, spark corrosion drilling, electrochemical drilling, spiral drilling and ultrasonic drilling. The electron beam drilling processing material is fixed as a metal material, and the processing device can only be carried out in a vacuum, otherwise the electrons are braked when they collide with atoms, and then turn. The processing material of the EDM drilling method can only be a conductive material, the drilling speed is relatively slow, and the overall processing cost is relatively high. The electrochemical drilling device needs to be processed in a liquid electrolyte, but the processing procedure is complicated and cumbersome, and the cycle of making holes is l...

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to overcome the deficiencies in the prior art, provide a device for making metal film group holes with ultrashort pulse laser, and solve the problems of low processing efficiency, easy generation of consumables and poor selectivity in micromachining.

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