Organic silicon modified phenolic resin encapsulating material and preparation method and usage thereof

A phenolic resin, silicone technology, applied in resistor casing/packaging/potting, fixed capacitor casing/packaging, resistors with positive temperature coefficient, etc., can solve the problem of poor pressure resistance, high manufacturing cost, mechanical strength low problems, to achieve the effect of significant economic benefits, low manufacturing costs, and low equipment investment

Inactive Publication Date: 2012-02-01
LAIZHOU SHUNLIDA ELECTRONICS MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] (1) Poor voltage resistance and poor insulation performance, the highest insulation voltage can only reach 1500V, and the highest insulation resistance can only reach 500 megohms
[0005] (2) Poor temperature resistance, poor moisture resistance, poor adhesion, low mechanical strength, easy agin...

Method used

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  • Organic silicon modified phenolic resin encapsulating material and preparation method and usage thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] Formula 1: The silicone-modified phenolic resin encapsulant is composed of the following raw materials in parts by weight: 17 parts of modified phenolic resin, 5 parts of titanium dioxide, 1 part of silicone, 60 parts of silicon micropowder, 5 parts of pigment, thixotropic 3 parts of desiccant, 5 parts of desiccant, 4 parts of curing agent. Among them: Except for the modified phenolic resin which is a specially developed new product, the rest of the raw materials are all existing products. The microsilica powder is a 320-mesh granular shape, and its main component is SiO 2 ≥99%, Fe 2 o 3 <3‰; the organosilicon is liquid organosilicon 560.

[0037] Use the preparation method of the organosilicon-modified phenolic resin encapsulant of formula 1, and its process step is as follows:

[0038] (1) Spray treatment: In the Φ600 vertical mixer, the diluted liquid silicone is evenly sprayed in the granular silicon micropowder in the form of a mist by an air pump, covering eac...

Embodiment 2

[0043]Formula 2: The organosilicon-modified phenolic resin encapsulant consists of the following raw materials in parts by weight: 15 parts of modified phenolic resin, 4 parts of titanium dioxide, 2 parts of silicone, 62 parts of silicon micropowder, 5 parts of pigment, thixotropic 3 parts of desiccant, 5 parts of desiccant, 4 parts of curing agent.

[0044] The steps of the method for preparing the silicone-modified phenolic resin encapsulant using Formula 2 are the same as those in Example 1.

Embodiment 3

[0046] Formula 3: The organosilicon modified phenolic resin encapsulant is composed of the following raw materials in parts by weight: 19 parts of modified phenolic resin, 5 parts of titanium dioxide, 1 part of silicone, 55 parts of silicon micropowder, 5 parts of pigment, thixotropic 3 parts of desiccant, 5 parts of desiccant, 7 parts of curing agent.

[0047] The steps of the method for preparing the silicone-modified phenolic resin encapsulant using Formula 3 are the same as those in Example 1.

[0048] The organosilicon modified phenolic resin encapsulating material of the invention is mainly used in encapsulating ceramic dielectric capacitors, ceramic filters and thermistors.

[0049] The organosilicon-modified phenolic resin encapsulant prepared by the present invention is in the form of dry powder. When used specifically, it needs to be mixed with a mixed solvent at a weight ratio of 100:25 to form an organosilicon for impregnating and encapsulating electronic component...

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Abstract

The invention discloses an organic silicone modified phenolic resin encapsulating material and a preparation method and usage thereof. The encapsulating material comprises the following components in parts by weight: 15-19 parts of modified phenolic resin, 3-5 parts of titanium white, 1-2 parts of organic silicon, 50-64 parts of silicon micro powder, 5 parts of pigment, 3 parts of thixotropic agent, 5 parts of drying agent and 4-7 parts of curing agent. The preparation method of the encapsulating material comprises the following steps: spraying, extrusion, crushing and ball milling. The encapsulating material has the advantages of high pressure resistance, temperature difference resistance, good insulating property, good moisture proof performance, high mechanical strength, quick natural drying, stable electric property, good adhesion, no cracking before and after curing, no color variation and the like, the production efficiency is increased by 20%, the output rate is improved by 10%, the manufacturing cost is reduced, the encapsulated product has a bright and attractive surface, is green and environment-friendly, and can replace an imported encapsulating material. The organic silicone modified phenolic resin encapsulating material is mainly used for the dipping encapsulation of porcelain medium capacitors, ceramic filters, thermistors and other electronic components.

Description

technical field [0001] The invention relates to the technical field of encapsulating material preparation, in particular to a silicone-modified phenolic resin encapsulating material for encapsulating electronic components, a preparation method thereof, and an application for encapsulating electronic components. Background technique [0002] With the development of society and the continuous improvement of people's living standards, the use and demand of electronic components are increasing. The encapsulation material is also the protective clothing of electronic components, which plays a very important role in the reliability and stability of electronic components. [0003] At present, the phenolic resin encapsulant used to encapsulate electronic components such as ceramic dielectric capacitors, ceramic filters, and thermistors is composed of the following raw materials: ordinary phenolic resin, titanium dioxide, silicon micropowder, pigments, Thixotropic agent, desiccant; ...

Claims

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Application Information

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IPC IPC(8): C08L61/14C08K13/06C08K9/06C08K3/36C08K3/22B29B13/10B29B9/00B29B7/80C08G8/28H01G4/224H01C7/02H01C7/04H01C1/02H01P1/20
Inventor 宋学群
Owner LAIZHOU SHUNLIDA ELECTRONICS MATERIAL
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