QFN (quad flat non-lead) package with multiple circles of pins and manufacturing method thereof
A leadless package, four-sided flat technology, applied in semiconductor/solid-state device manufacturing, electrical components, electric solid-state devices, etc., can solve the problems of lead frame and plastic packaging material falling off, high density, limited I/O quantity, etc. , to achieve the effect of improving bonding quality and surface mount quality, preventing metal burrs, and reducing packaging costs
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[0058] The present invention is described in detail below in conjunction with accompanying drawing:
[0059] Figure 2A A schematic diagram of the rear side of a QFN package structure in which the cross-section of the pins is circular and the pins on each side of the chip carrier are arranged in parallel according to the embodiment of the present invention. Figure 2B A schematic diagram of the back side of a QFN package structure in which the cross-section of the pins is rectangular and the pins on each side of the chip carrier are arranged in parallel according to the embodiment of the present invention.
[0060] Refer to the above Figure 2A -B It can be seen that, in this embodiment, the lead frame 201 of the multi-turn pin arrangement QFN package structure 200a and 200b includes a chip carrier 202 and pins 203 arranged in multi-turn around the chip carrier 202, and the chip carrier 202 is each The side pins 203 are arranged in parallel, the metal material layer 23 is ar...
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