Method for separation and recovery of metal and nonmetal in waste printed circuit board

A technology for separating and recycling waste circuit boards, which is applied in the fields of electronic waste recycling, recycling technology, and solid waste removal. Reduce the difficulty of separation and recovery and avoid the effect of destructive crushing

Inactive Publication Date: 2012-02-15
DALIAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Vacuum devices are used in many places in this process, the cost of equipment is high, and the cost of operation and maintenance is high

Method used

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  • Method for separation and recovery of metal and nonmetal in waste printed circuit board
  • Method for separation and recovery of metal and nonmetal in waste printed circuit board
  • Method for separation and recovery of metal and nonmetal in waste printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] Embodiments of the invention employ the following steps:

[0017] (1) The waste circuit board with electrical components removed is pyrolyzed at 800°C, and the resin bonded between the glass fiber cloth and the metal layer is pyrolyzed and carbonized at high temperature, and the bonding strength between the glass fiber cloth and the metal layer is greatly reduced ;

[0018] (2) Send the waste circuit board pyrolysis residue collected in step (1) to the first-level double smooth roller rolling equipment for rolling, so that the resin pyrolytic carbon between the glass fiber layer and the glass fiber layer and the metal layer will fall off , the glass fiber cloth is completely separated from the metal layer in sheet form;

[0019] (3) The mixture of glass fiber sheet, metal sheet and carbon powder in step (2) is separated into carbon powder by vibrating screening equipment; First-level rolling equipment, rolling and sieving again until the material is completely dissoci...

Embodiment 2

[0023] Embodiments of the invention employ the following steps:

[0024] (1) The waste circuit board with electrical components removed is pyrolyzed at 800°C, and the resin bonded between the glass fiber cloth and the metal layer is pyrolyzed and carbonized at high temperature, and the bonding strength between the glass fiber cloth and the metal layer is greatly reduced ;

[0025] (2) Send the waste circuit board pyrolysis residue collected in step (1) to the first-level double smooth roller rolling equipment for rolling, so that the resin pyrolytic carbon between the glass fiber layer and the glass fiber layer and the metal layer will fall off , the glass fiber cloth is completely separated from the metal layer in sheet form;

[0026] (3) The mixture of glass fiber sheet, metal sheet and carbon powder in step (2) is separated into carbon powder by vibrating screening equipment; First-level rolling equipment, rolling and sieving again until the material is completely dissoci...

Embodiment 3

[0029] Embodiments of the invention employ the following steps:

[0030] (1) The waste circuit board with electrical components removed is pyrolyzed at 800°C, and the resin bonded between the glass fiber cloth and the metal layer is pyrolyzed and carbonized at high temperature, and the bonding strength between the glass fiber cloth and the metal layer is greatly reduced ;

[0031] (2) Send the waste circuit board pyrolysis residue collected in step (1) to the first-level double smooth roller rolling equipment for rolling, so that the resin pyrolytic carbon between the glass fiber layer and the glass fiber layer and the metal layer will fall off , the glass fiber cloth is completely separated from the metal layer in sheet form;

[0032] (3) The mixture of glass fiber sheet, metal sheet and carbon powder in step (2) is separated into carbon powder by vibrating screening equipment; First-level rolling equipment, rolling and sieving again until the material is completely dissoci...

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PUM

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Abstract

The invention belongs to the field of recovery and utilization of waste printed circuit boards, and specially, relates to a method for separation and recovery of metal copper and a glass fiber cloth in a waste printed circuit board. The method comprises the following steps that putting an electric element-free waste circuit board into a pyrolysis furnace to carry out pyrolysis treatment, wherein a resin for bonding a glass fiber cloth and a metal layer is pyrolyzed into carbon, carrying out treatment on the residues obtained by the previous step by a two-stage smooth roll rolling technology, and carrying out screening to obtain a carbon powder, metal and glass fiber concentrate. In the invention, a first-stage rolling process aims at shedding pyrolytic carbon between a glass fiber cloth and a metal layer, wherein each layer of the electric element-free waste circuit board is completely separated from other layers of the electric element-free waste circuit board and carbon powder is separated out after screening; and a second-stage rolling process aims at crushing devastatingly the glass fiber cloth and rolling up the metal layer which is flexible into a roll, so that through screening, metal-nonmetal separation is realized. In addition, metal and nonmetal in a mixture obtained by the first-stage rolling process and screening can be separated out directly by an electric separation method or a pneumatic preparation method. Through the combination of pyrolysis and physical processes, the method provided by the invention realizes high-efficiency separation of metal and nonmetal from a waste circuit board, and finally, realizes the purpose of eco-friendly resource recovery of waste circuit boards.

Description

technical field [0001] The invention belongs to waste recycling technology, in particular to the recycling of waste printed circuit boards in electronic waste and the corners and scraps existing in the manufacturing process of circuit boards, so as to effectively separate metals and non-metals contained therein. Specifically relates to a method for separating and recycling metal and nonmetal in waste printed circuit boards. Background technique [0002] The circuit board is a mixture of glass fiber reinforced resin and various metals. Metals and non-metals are closely combined and difficult to separate. It is the most complicated and difficult to handle in electronic waste, and requires high technical content. At present, the processing of waste circuit boards at home and abroad mainly adopts crushing equipment with shearing effect, such as rotary crushers and shredders. When the waste circuit board is generally broken to 0.6mm, the metal can basically achieve 100% dissocia...

Claims

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Application Information

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IPC IPC(8): B09B3/00B09B5/00C22B7/00C22B15/00
CPCY02P10/20Y02W30/82
Inventor 李爱民全翠高宁博
Owner DALIAN UNIV OF TECH
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