Silicon block cutting method

Abstract

The embodiment of the invention discloses a silicon block cutting method which comprises the following steps: driving a cooling fluid into a mortar jar; sequentially winding a diamond steel wire on a pulley and a guide pulley to knit a wire mesh; putting a silicon block on a machine tool, and setting a machine tool zero point and technological parameters in the silicon block cutting process; and cutting the silicon block by using the diamond steel wire. In the cutting method disclosed by the invention, the diamond steel wire is knitted into the wire mesh, and the wire mesh is used for cutting the silicon block, thereby replacing the method for cutting a silicon block by driving mortar with a steel wire in the prior art. Since the diamond grains have high hardness and strong cutting power, the cutting power of the diamond steel wire is stronger than that of the mortar-carrying steel wire, thereby greatly enhancing the cutting efficiency of the silicon block, increasing the cutting speed of the silicon block and lowering the cutting cost.

Description

technical field [0001] The invention relates to the technical field of solar cell manufacturing, and more specifically, to a silicon block cutting method. Background technique [0002] Multi-wire cutting machine is a high-efficiency cutting equipment that has developed extremely rapidly in recent years. Its main feature is that the cutting consumables are small, and the performance indicators such as the surface roughness, TTV value, curvature, and warpage of the cut silicon wafer are better than other processing. Way. Therefore, in addition to being widely used in traditional semiconductor processing, multi-wire cutting machines have also become the main means of cutting solar-grade silicon wafers with the explosive development of the solar industry. Among them, multi-wire cutting is a new type of cutting process that uses high-speed reciprocating motion of metal wires to bring abrasives into the semiconductor processing area for grinding, and cut hard and brittle material...

AI Technical Summary

Problems solved by technology

[0004] However, the main body of cutting in the mortar is silicon carbide. When cutting silicon blocks, sufficient silicon carbide must be ensured to participate in the cutting. However, the production process of silicon carbide consumes a lot of energy and pollutes a lot, which leads to the high cost of this cutting method and is subject to steel Limited by wire cutting ability and silicon carbide participation ability, the cutting rate is relatively low

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